| Camera | Zone camera: the ball (74 mm) at the top of a tall batter's zone at 1 m | 75.3 px | ≥ 20 px | passes |
| Camera | Zone camera: smear at 151 km/h, 0.3 ms exposure | 12.6 mm | ≤ 1/3 of the ball (25 mm) | passes |
| Camera | Zone camera: frame rate the calls need | 120 fps at 1280 × 800 | chip: 120 fps at 1280 × 800, 180 fps at 640 × 400 | passes |
| Camera | Zone camera: data rate vs its 2-lane link | 1.23 Gbps (10-bit) | ≤ 80 % of 1.6 Gbps | passes |
| Camera | Front camera: the ball (74 mm) 2 m in front of the plate at 2.2 m | 41.1 px | ≥ 15 px | passes |
| Camera | Front camera: smear at 158 km/h, 0.25 ms exposure | 11 mm | ≤ 1/3 of the ball (25 mm) | passes |
| Camera | Front camera: frame rate the calls need | 120 fps at 1280 × 800 | chip: 120 fps at 1280 × 800, 180 fps at 640 × 400 | passes |
| Camera | Front camera: data rate vs its 2-lane link | 1.23 Gbps (10-bit) | ≤ 80 % of 1.6 Gbps | passes |
| Camera | Base camera (each base): the ball (74 mm) on the line 2 m before the bag at 2 m | 17 px | ≥ 10 px | passes |
| Camera | Base camera (each base): smear at 108 km/h, 0.5 ms exposure | 15 mm | ≤ 1/3 of the ball (25 mm) | passes |
| Camera | Base camera (each base): frame rate the calls need | 30 fps at 800 × 600 | chip: 30 fps at 800 × 600, 15 fps at 1600 × 1200 | passes |
| Camera | Base camera (each base): data rate vs its 1-lane link | 0.12 Gbps (8-bit) | ≤ 80 % of 0.192 Gbps | passes |
| Camera | Image processor load, all cameras | 260 Mpx/s | ≤ 360 Mpx/s (RV1126B ISP) | passes |
| Camera | Cameras in step for timed calls | one frame-sync line from the RV1126B to both OV9281 chips; each base time-stamps its frames and foot touches to the plate's clock over BLE | plate cameras in step; bases within 2 ms of the plate (est.) | passes |
| Camera | AI engine time per frame | 3 TOPS | ball finder on both cameras inside the 8.3 ms frame at 120 fps | to prove on the dev kit |
| Battery | Run time, 4 cells, worst case (aged to 80 %, 5 °C) | 12.4 h | ≥ 10 h | passes |
| Battery | Run time, 4 cells, new, 20 °C | 17.6 h | ≥ 10 h | passes |
| Battery | Spare run time, worst case | 24 % over 10 h | ≥ 20 % (the draw is an estimate until rev A) | passes |
| Battery | Charge time | 10.3 h from flat at 1.5 A; 9 h overnight puts back 100 % of a day | a full day back overnight (9 h) | passes |
| Battery | Peak current from the cells | 2.52 A at 2.65 V | ≤ 32 A (4 × 8 A) | passes |
| Battery | Each pack has its own protector | 2 protectors (U4, U24) for 2 chargers | short, over-current and over-discharge cut-off on every pack | passes |
| Battery | Charging held outside the cells' temperature range | thermistor on the pack, read by the charger | 0–45 °C | passes |
| Heat | RV1126B temperature, full sun, 35 °C air | 49 °C | ≤ 85 °C (rated) | passes |
| Heat | Cell temperature, full sun, 35 °C air | 45 °C | ≤ 60 °C | passes |
| Shock | Clocks rated for the shock | MEMS oscillators | every clock rated for 1000 g | fixed by the review |
| Shock | Ball-grid chips | underfill under U1, U10, U5, U8 | no cracked joints after the drop and hit tests | to prove on the dev kit |
| Software | Starts our software from the microSD card, no setup | microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; microSD socket with a hinged, latched lid (Amphenol 101-00660 class): our software starts from the card | card socket fitted on every board, latched | fixed by the review |
| Software | Card power switch and protection | 2 power switches and 2 ESD arrays for 2 card sockets | every socket: switched card supply, ESD on all 6 lines | fixed by the review |
| Software | The card wins the start | eMMC shipped empty; our loader reads the card first | the processor starts from the card every time | fixed by the review |
| Software | Card grade | industrial pSLC microSD (Kingston Industrial or Swissbit S-56u), −40 to 85 °C | rated for the heat, cold and writes | to prove on the dev kit |
| Software | Clip buffer for an unsure call | 6.7 s of 8-bit 120 fps video in 40 % of the 2 GB memory | ≥ 3 s | passes |
| Radio | Wi-Fi/BT module clock | 37.4 MHz MEMS oscillator (Y2) | 37.4 MHz next to the AP6256, MEMS (shock) | passes |
| Radio | Wi-Fi and BLE from the plate | chip antenna under the radome well, the only gap in the cast aluminium tub | certified AP6256 module; phone in the dugout at 20 m, bases at 18 to 26 m | to prove on the dev kit |
| Radio | BLE from each base | ESP32-S3 module antenna at the board edge, under foam and a plastic tray | to the plate at 18 to 26 m (27.4 m at full size) | passes |
| Moisture | Conformal coating | coated | coated, sensors, sockets and antennas masked | passes |
| Fit | Board inside the product CAD, every part checked in 3D | not yet in the product CAD | nothing touches | to prove on the dev kit |
| Camera | Every plate call in its sensor's view | zone camera worst 0° up or down; front camera worst 10.8°; radar worst 12.3° | inside each field of view, and every ray over the plate's front edge | passes |
| Fit | Radome and front window run out to the front bevel | both wells lengthened to the plate's front edge under a flush clear PC skin | the rays to the pitcher clear the top; the skin takes spikes and a 150 km/h ball | to prove on the dev kit |
| Radar | Pitch speed from the plate | the 60 GHz chip reads the ball from about 2.5 m in (knee high) and the ball off the bat | pitch speed within 1 km/h of a reference gun | to prove on the dev kit |
| Camera | Base camera through its Ø12 window | the 6 mm wall leaves ±43.6° round the lens; the lens wants ±50° across | no vignetting over the calls | to prove on the dev kit |
| Battery | Base run time, 2 cells, worst case | 25.7 h | ≥ 10 h | passes |
| Fit | Heat boss and tamper posts | a 39 mm cast boss under the processor; a 31.9 mm post on the plate top's underside; a post under each base lid | added in the rev T CAD and checked in 3D | to prove on the dev kit |