Our own circuit boards, in the home plate and the bases

One board we design for the smart home plate and one for each base, with every chip soldered on them. The plate board lies in the cast plate tub in the plate’s own five-sided shape, with the RV1126B brain, a camera head held up in the strike-zone window and two tabs bent up to look at the pitcher: a 60 GHz radar chip and a second camera. Each base board lies in its tray with an ESP32-S3 module, and a strip bent up behind the camera face with the camera chip, the mic and the call light. No bought computer boards, plugs, ribbons or adapters inside.

Stage 1 of 6 done: shape and placementNot yet ready to manufactureUpdated 4 November 2026 · rev A-0

Design files Design review Quote pack Who can make it Our board platform

The board in 3D

Every part at its real size, in its real place. Turn it, zoom in, switch between the boards in the plate and a base and laid flat, and click any part to see what it is. The chip bodies are simple blocks until each part's own 3D model is added.

Show the plate and base

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Drag to turn · scroll to zoom · right-drag to move · click a partDrag to turn · tap a part

Where everything is in the plate and the bases

Zone cameraplate, middle

An OV9281 global-shutter camera chip on a small head held up in the Ø34 window, looking straight up the strike zone at 120 frames a second: where the ball crosses the zone for every batter from 1.50 to 1.87 m.

Radar and front cameraplate, front edge

Two small tabs bent up to look 30° up at the pitcher: a TI 60 GHz radar chip for the speed of every pitch and every ball off the bat, and a second OV9281 for the last 2 m of the pitch. Their windows run out to the plate’s front bevel so the view clears the top.

Brain and radioplate board

The RV1126B with its memory, a copper block down to the tub floor (the ground is the heat sink), Wi-Fi and Bluetooth with the antenna under the radome, the security chip that signs every call and the latched microSD card with our software.

Power and call lightplate board

Four cells soldered under the board with their charger and one latched lead to the sealed charge socket; eight LEDs under a light guide to the clear strip, a sounder under the tone holes and the tamper switch.

Each basebase tray

The ESP32-S3 module, a camera chip with a wide lens just inside the window towards home (or first), a mic for the glove pop, the four foot sensors’ tails soldered to the board, the call light, a sounder, two cells and a tamper switch.

The plate and base boards laid flat, both sides, every part at its real size

Laid flat: the plate board with its zone head (on its tail, drawn short), radar tab and front tab, and the base board with its front strip. Tap the drawing to open it full size.

Design review: checked before we order

Every board-level number DiamondOne's jobs depend on, checked against its target with the source of each number, using the rules every one of our boards shares (products/_shared/board-rules.mjs). Fixed means a lesson changed this board; to prove means it passes on paper and is measured on rev A before boards are ordered.

No check fails29 pass · 4 fixed by the review · 10 to prove before we order · 0 failDesign review of 4 November 2026

Area	Check	Our board	Target	Status
Camera	Zone camera: the ball (74 mm) at the top of a tall batter's zone at 1 m M12 2.1 mm lens, about 72° across: about 17.8 px per degree across 1280 px. The ABS flat zone at mid-plate, 27 to 53.5 % of the batter's height: 1.0 m for a 1.87 m batter. A 150 km/h pitch crosses the 17 in plate in 10 ms, so 120 fps gives one frame over the plate and the track gives the crossing point.	75.3 px	≥ 20 px	passes
Camera	Zone camera: smear at 151 km/h, 0.3 ms exposure A global shutter freezes the whole frame at once.	12.6 mm	≤ 1/3 of the ball (25 mm)	passes
Camera	Zone camera: frame rate the calls need A standard mode of the OV9281.	120 fps at 1280 × 800	chip: 120 fps at 1280 × 800, 180 fps at 640 × 400	passes
Camera	Zone camera: data rate vs its 2-lane link 23 % spare on the link.	1.23 Gbps (10-bit)	≤ 80 % of 1.6 Gbps	passes
Camera	Front camera: the ball (74 mm) 2 m in front of the plate at 2.2 m M6 lens, about 60° across: about 21.3 px per degree across 1280 px. The last 2 m of the pitch and the first 1.5 m off the bat (up to 160 km/h).	41.1 px	≥ 15 px	passes
Camera	Front camera: smear at 158 km/h, 0.25 ms exposure A global shutter freezes the whole frame at once.	11 mm	≤ 1/3 of the ball (25 mm)	passes
Camera	Front camera: frame rate the calls need A standard mode of the OV9281.	120 fps at 1280 × 800	chip: 120 fps at 1280 × 800, 180 fps at 640 × 400	passes
Camera	Front camera: data rate vs its 2-lane link 23 % spare on the link.	1.23 Gbps (10-bit)	≤ 80 % of 1.6 Gbps	passes
Camera	Base camera (each base): the ball (74 mm) on the line 2 m before the bag at 2 m M7 wide lens, about 100° across: about 8 px per degree across 800 px. Fair or foul at first and third and the throw into the glove; the foot sensors time the runner's touch to 1 ms, so the camera frame rate does not set the force-out time.	17 px	≥ 10 px	passes
Camera	Base camera (each base): smear at 108 km/h, 0.5 ms exposure A rolling shutter skews a fast target: check the readout time.	15 mm	≤ 1/3 of the ball (25 mm)	passes
Camera	Base camera (each base): frame rate the calls need A standard mode of the OV2640.	30 fps at 800 × 600	chip: 30 fps at 800 × 600, 15 fps at 1600 × 1200	passes
Camera	Base camera (each base): data rate vs its 1-lane link 40 % spare on the link.	0.12 Gbps (8-bit)	≤ 80 % of 0.192 Gbps	passes
Camera	Image processor load, all cameras 3 cameras into one image processor.	260 Mpx/s	≤ 360 Mpx/s (RV1126B ISP)	passes
Camera	Cameras in step for timed calls The pitch track joins the front and zone cameras frame by frame; a force out compares the base's foot touch with the glove's catch, both timed in the base. A real-time (PREEMPT_RT) kernel is asked for in the quote (lesson: sync).	one frame-sync line from the RV1126B to both OV9281 chips; each base time-stamps its frames and foot touches to the plate's clock over BLE	plate cameras in step; bases within 2 ms of the plate (est.)	passes
Camera	AI engine time per frame Two 1280 × 800 streams; the ball finder runs on a cropped window round the predicted track. Measured on the dev kit.	3 TOPS	ball finder on both cameras inside the 8.3 ms frame at 120 fps	to prove on the dev kit
Battery	Run time, 4 cells, worst case (aged to 80 %, 5 °C) A 10-hour tournament day in the plate (7 h of games, est.) uses 24.6 Wh: 3 W for 7 h (in play: RV1126B, two cameras at 120 fps, radar, Wi-Fi and BLE to the bases), 0.3 W for 3 h (between games: RV1126B asleep, BLE awake), through a 90 % converter. 4 × Samsung INR18650-35E, counted at 3.35 Ah (lesson: battery).	12.4 h	≥ 10 h	passes
Battery	Run time, 4 cells, new, 20 °C New cells at room temperature.	17.6 h	≥ 10 h	passes
Battery	Spare run time, worst case Room for the estimate to be wrong.	24 % over 10 h	≥ 20 % (the draw is an estimate until rev A)	passes
Battery	Charge time TI BQ24074 1.5 A charger with power path, through the sealed M8 charge socket (lesson: charge).	10.3 h from flat at 1.5 A; 9 h overnight puts back 100 % of a day	a full day back overnight (9 h)	passes
Battery	Peak current from the cells Inside the cells and the converter.	2.52 A at 2.65 V	≤ 32 A (4 × 8 A)	passes
Battery	Each pack has its own protector The charger only stops charging; a short or a flat pack needs its own cut-off, at the thresholds of its chemistry (lesson: cellguard).	2 protectors (U4, U24) for 2 chargers	short, over-current and over-discharge cut-off on every pack	passes
Battery	Charging held outside the cells' temperature range Lithium cells must not be charged when cold or hot (lesson: charge).	thermistor on the pack, read by the charger	0–45 °C	passes
Heat	RV1126B temperature, full sun, 35 °C air The heat block goes down to a cast boss on the tub floor 120 mm under the ground, where the soil stays near 30 °C in summer (est.); the white rubber top takes the sun. 1.8 W through a 16 mm copper block and gap pad onto a 39 mm cast boss on the tub floor (6 K/W, est.).	49 °C	≤ 85 °C (rated)	passes
Heat	Cell temperature, full sun, 35 °C air The cells hang under the board in the sealed tub, shaded by the 20 mm top; about 45 °C in full sun (est.). Charging is held above 45 °C (lesson: sun).	45 °C	≤ 60 °C	passes
Shock	Clocks rated for the shock A 150 km/h foul tip or a slide into the plate, spikes and the catcher's gear on the top; a plate dropped on concrete when carried (est.). Quartz crystals are not rated for that; MEMS oscillators are rated to 50,000 g (lesson: clocks). Change: Y1, Y2 and the radar's clock are MEMS oscillators from the start (the CricketOne lesson).	MEMS oscillators	every clock rated for 1000 g	fixed by the review
Shock	Ball-grid chips Underfill and flexible-termination capacitors are asked for in the quote; the drop tests on rev A prove them (lesson: underfill).	underfill under U1, U10, U5, U8	no cracked joints after the drop and hit tests	to prove on the dev kit
Software	Starts our software from the microSD card, no setup Owner requirement: power it from its own supply and our software runs from the card. The plate boots from the card (the eMMC holds no system copy (it ships empty, so the card always starts first: Rockchip tries the eMMC before the card); the quote asks for U-Boot and a device tree from Rockchip's RV1126B SDK); the maker flashes our small loader into each base's ESP32-S3, which starts our program from its card. Updates are signed and never during a game. Change: J2 and J22 are hinged, latched microSD sockets fitted on every board.	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; microSD socket with a hinged, latched lid (Amphenol 101-00660 class): our software starts from the card	card socket fitted on every board, latched	fixed by the review
Software	Card power switch and protection A card that hangs must be restarted by cutting its power, not the whole board; the card slot is the one place a person touches the electronics (lesson: sdstart). Change: U90, U92, U91, U93 added (4 Nov 2026, CricketOne card-start review).	2 power switches and 2 ESD arrays for 2 card sockets	every socket: switched card supply, ESD on all 6 lines	fixed by the review
Software	The card wins the start Rockchip's start order is SPI flash, eMMC, card, USB: a written eMMC starts before the card. Proved on the dev kit: power on with a card in and the eMMC empty (lesson: sdstart). Change: eMMC ships empty and the loader reads the card first (4 Nov 2026; it used to say the eMMC kept a copy, which would have started instead of the card).	eMMC shipped empty; our loader reads the card first	the processor starts from the card every time	fixed by the review
Software	Card grade Consumer cards wear out and fail hot; the image is read-only with a separate data partition. Proved: 1,000 power cuts during writes on rev A (lesson: sdstart).	industrial pSLC microSD (Kingston Industrial or Swissbit S-56u), −40 to 85 °C	rated for the heat, cold and writes	to prove on the dev kit
Software	Clip buffer for an unsure call The rest of the memory holds Linux, the program and the AI model (lesson: clip).	6.7 s of 8-bit 120 fps video in 40 % of the 2 GB memory	≥ 3 s	passes
Radio	Wi-Fi/BT module clock The AP6256 runs from its own 37.4 MHz reference clock; a wrong or missing clock means no Wi-Fi or Bluetooth at all (lesson: wificlock).	37.4 MHz MEMS oscillator (Y2)	37.4 MHz next to the AP6256, MEMS (shock)	passes
Radio	Wi-Fi and BLE from the plate The plate is flush with the ground, so the antenna sees out only through the radome skin, low over the dirt. Measured on rev A (lesson: antenna).	chip antenna under the radome well, the only gap in the cast aluminium tub	certified AP6256 module; phone in the dugout at 20 m, bases at 18 to 26 m	to prove on the dev kit
Radio	BLE from each base No metal round the base board; a runner standing on the bag is the worst case, checked on the dev kit.	ESP32-S3 module antenna at the board edge, under foam and a plastic tray	to the plate at 18 to 26 m (27.4 m at full size)	passes
Layout	Fast lines on a solid ground plane The layout rules go to the maker in the quote; the routed board's design rule check (0 copper errors, every keep-out kept) and the maker's impedance coupon prove them (lesson: planes).	RV1126B memory; 4 camera MIPI links (100 Ω pairs); USB (90 Ω); antenna feed (50 Ω, keep-out on every layer); card lines (length-matched, no vias under the socket)	ground on inner layer 1, supply on inner layer 2, no vias in pads, impedance lines routed first	to prove on the dev kit
Moisture	Conformal coating The plate and bases sit in wet dirt and rain, are hosed down and raked; the plate tub is sealed, the base tray too. Asked for in the quote (lesson: moisture).	coated	coated, sensors, sockets and antennas masked	passes
Fit	Board inside the product CAD, every part checked in 3D The board is checked on its own; the rev T CAD run places it in the product and checks every part in 3D (lesson: fit3d).	not yet in the product CAD	nothing touches	to prove on the dev kit
Camera	Every plate call in its sensor's view The zone corners for batters 1.50 to 1.87 m, the pitch 1 and 2 m out, the ball off the bat and the pitch 2.5 m out are all in view from where the chips sit (zone lens front at z -3.5, front lens at 186.3, -7.2, radar at 178.0, -10.2), and each ray passes above the ground at the plate's front edge.	zone camera worst 0° up or down; front camera worst 10.8°; radar worst 12.3°	inside each field of view, and every ray over the plate's front edge	passes
Fit	Radome and front window run out to the front bevel In rev O the windows were holes in the middle of the 20 mm top: from 7 to 10 mm under the ground, a ray 15° up hits the top before it leaves. Running the wells out to the bevel fixes the view; the skin's strength (spikes, a ball, a slide) is tested on rev A (lesson: window). Change: CAD rev T: radome well y 140 to the front edge (was 120 to 180), front window well 170 to the front edge (was 170 to 200), 3 mm flush PC skins (4 Nov 2026).	both wells lengthened to the plate's front edge under a flush clear PC skin	the rays to the pitcher clear the top; the skin takes spikes and a 150 km/h ball	to prove on the dev kit
Radar	Pitch speed from the plate Flush in the ground, the radar cannot see the release; the release speed is worked back from the speed over the last 2.5 m with the drag model (est.). Measured against a reference gun in a cage on the maker's evaluation board.	the 60 GHz chip reads the ball from about 2.5 m in (knee high) and the ball off the bat	pitch speed within 1 km/h of a reference gun	to prove on the dev kit
Camera	Base camera through its Ø12 window Every base call sits within 29.2° up or down and 21° across, inside the hole's cone; the corners of the frame are cut. Rev T opens the window to Ø16 with a chamfer.	the 6 mm wall leaves ±43.6° round the lens; the lens wants ±50° across	no vignetting over the calls	to prove on the dev kit
Battery	Base run time, 2 cells, worst case About 0.7 W in play (ESP32-S3, OV2640 at 30 fps, BLE, foot sensors) for 7 h and 0.15 W between games (est.): 5.9 Wh a day from two cells aged to 80 % at 5 °C.	25.7 h	≥ 10 h	passes
Fit	Heat boss and tamper posts The board brings the heat path and both tamper switches; the CAD rev T adds the boss and posts they need.	a 39 mm cast boss under the processor; a 31.9 mm post on the plate top's underside; a post under each base lid	added in the rev T CAD and checked in 3D	to prove on the dev kit

Before we order the first boards, we prove these on the RV1126B development kit or in the rev A tests:

AI engine time per frame
Ball-grid chips
Card grade
Wi-Fi and BLE from the plate
Fast lines on a solid ground plane
Board inside the product CAD, every part checked in 3D
Radome and front window run out to the front bevel
Pitch speed from the plate
Base camera through its Ø12 window
Heat boss and tamper posts

Where the design stands

1Shape and placementdone
The plate board in the plate’s five-sided shape with its zone head, radar tab and front tab, and the base board with its front strip, all 73 parts placed at their real size, every call checked from where the chips sit, and KiCad design rule check (0 violations).
2Schematicnext
Every wire between the chips, from the V1, S1 and C1 core circuits.
3Footprintsnext
The exact solder pads under each chip.
4Routinglater
Copper tracks on all layers, the camera lanes along the tab and tail flexes.
5Files for the makerlater
Gerbers with copper, drill, mask, paste, the rigid-flex drawing and the assembly parts list. These go to the board maker.
6Rev A boardsafter CricketOne
Made, assembled and tested on our fixture.

Design files (rev A-0)

These are the stage 1 files: the board's shape and where every part goes. A board maker needs the stage 5 files to build it.

All files (zip)Everything below in one download, with the quote and review KiCad boarddiamondone-board.kicad_pcb: open with KiCad 10 (free)3D model (STEP)The bare board for mechanical CAD Side A drawing (PDF)Plate board down, tabs to the pitcher, base strip out Side B drawing (PDF)Plate and base boards, top side Parts and placement (CSV)Every part, its size, side and position

Who can make it

The plate board is one 8-layer board with three 2-layer pieces on flexes; the base board one 4-layer board with a 2-layer strip. They need a maker who builds rigid-flex boards with long flex tails. We plan three quotes once the stage 5 files are ready: two from China for price, and one from the US for speed.

Maker	Where	Rigid-flex	HDI / layers	Assembly	Fit for us
PCBWayfirst quote	Shenzhen, China	yes, 6 to 16 layers	HDI up to 32 layers, 0.35 mm BGA pitch	yes, turnkey, incl. BGA and X-ray	Best fit for rev A: the rigid-flex board and its assembly in one order
NextPCBsecond quote	Shenzhen, China	yes	HDI, 6 to 32 layers	yes (PCBA)	Second quote, to compare price and lead time
ALLPCB	China (a network of partner factories)	yes, through partner factories	1 to 30 layers	yes	Third quote; check which factory builds it
JLCPCB	Shenzhen, China	no (flex only: 1, 2 and 4 layers, up to 490 mm)	HDI added Sep 2026	yes, incl. BGA	Not for the one-piece board today. Good for the test fixture, simple boards, and the fallback of separate rigid boards joined by soldered flex
Sierra Circuits (ProtoExpress)US quote	Sunnyvale, California, USA	yes	yes	yes, in-house, incl. BGA; turnkey in about 5 days	US option: fastest turn and engineering help, at a higher price
Cirexx	Santa Clara, California, USA	yes	yes	yes (turnkey or consigned)	Second US option
Advanced Circuits	Aurora, Colorado, USA	yes	check	yes	US quick-turn; check its rigid-flex assembly
Epec	New Bedford, Massachusetts, USA	yes	check	yes; also builds battery packs	US option that can also make a certified LiFePO4 pack

From each maker's own capability pages, checked 3 November 2026. Limits change, so each quote confirms them for our exact stack-up.

Full design notes

All 73 parts, what is on each board, every connection, heat, power, the factory test, cost and timeline.

DiamondOne: one circuit board of our own in the plate, one in each base

The home plate and the three bases are the product. Each now carries one board of our own with every chip soldered on it, in the shape of the item it sits in. The bench build used a Raspberry Pi Zero 2 W, a Raspberry Pi AI Camera, a OmniPreSense OPS243-A radar module, three Seeed XIAO ESP32-S3 Sense boards and Adafruit power and light boards; none of them stays. There are no plugs, ribbons or adapters inside, only latched leads to the charge sockets.

Board	Core (products/PCB-PLATFORM.md)	Where
Plate board	V1 (RV1126B) + two C1 camera chips + a 60 GHz radar chip	flat in the cast plate tub, 40 mm under the top
Base board (×3)	S1 (ESP32-S3 module) + one C1 camera chip	flat in each base tray, 4 mm over the floor

Every number marked est. is measured on the first boards (rev A).

1. The shape

Plate board. An 8-layer board cut to the plate’s five-sided shape (340 × 339 mm), side A down to the tub floor, side B up to the top. Three pieces bend off it:

Zone head: a 20 × 20 mm head on a 10 mm flex tail (about 200 mm, est.), held on a printed post up in the Ø34 window well. Its OV9281 camera chip looks straight up the strike zone; the lens front is 0.5 mm under the window cover.
Radar tab: 32 × 59 mm, bent up and back from a tongue at the front edge so its face looks 30° up at the pitcher. The TI IWR6843AOP 60 GHz radar chip sits on it, its top end up in the radome well.
Front tab: 24 × 54 mm, bent the same way from a second tongue. Its OV9281 camera chip looks 30° up at the pitcher, with the lens front 7 mm under the ground in the front window well.

Base board. A 4-layer 300 × 320 mm board flat over the tray floor, and a 200 × 79 mm front strip bent 90° up behind the camera face (side A out, 10 mm behind the face).

2. What is on the boards

Plate board	Part
U1	Rockchip RV1126B on side A, a copper heat block down to a cast boss on the tub floor
U10, U5, U3	2 GB LPDDR4X, 32 GB eMMC, PMIC
Y1, Y2	MEMS oscillators (no quartz: the plate takes ball strikes and slides)
U6, AE1	AMPAK AP6256 Wi-Fi 5 + BT 5, chip antenna under the radome well
U2, U9, J2	ATECC608B security chip, ID chip, latched microSD with our software
BT1–BT4, RT1–RT2, U4, J1	four soldered 18650 holders (1S4P), thermistors, BQ24074 1.5 A charger, latched lead to the sealed M8 charge socket
D1–D8, LP1, LS1, SW1	call-light LEDs under a printed light guide, sounder under the tone holes, tamper switch
U11, L1 (zone head)	OV9281 1 MP global shutter, M12 2.1 mm lens, about 72° × 52°
U8, U12 (radar tab)	TI IWR6843AOP, its flash and MEMS clock
U13, L2 (front tab)	OV9281 1 MP global shutter, M6 lens, about 60° × 45°

Base board	Part
U21	ESP32-S3-WROOM-1-N16R8, antenna end at the right edge
U22, U29, J22	security chip, ID chip, latched microSD
BT21–BT22, RT21, U24, J21	two soldered 18650 holders, thermistor, charger, latched charge lead
PD21–PD24	solder pads for the four foot sensors’ tails, each with a strain-relief slot
SW21	tamper switch under a post on the tray lid
U23, L3 (front strip)	OV2640 2 MP at SVGA 30 fps, M7 wide lens about 100° × 75°
MK21, LS21, D21–D28	MEMS mic (the glove pop), sounder, call-light LEDs

3. Every connection, checked

Link	How	Checked
Both OV9281 chips to the RV1126B	2-lane MIPI CSI-2 each, on the board and along the tab and tail flexes; one frame-sync line to both	lanes 1.23 Gbps of 1.6 (23 % spare)
Radar to the RV1126B	SPI and the radar’s own UART on the tab flex	TI IWR6843AOP reference design
Base camera to the ESP32-S3	8-bit camera port on the strip flex	ESP32-S3 camera interface, SVGA at 30 fps
Foot sensors	two pads each, a divider into an ADC pin, the tail soldered and clamped	Alpha MF02A FSR tails are solderable
Plate to bases	BLE LE Secure Connections, signed calls; each base times its frames and foot touches to the plate’s clock	18 to 26 m
Charging	one latched Micro-Fit lead to a sealed M8 socket under a rubber cap (plate in the tub wall, base in the tray’s back face)	the only connector on each board

4. Heat

The RV1126B draws about 1.8 W in play (est.). Its heat block goes down to a 39 mm cast boss on the tub floor; the plate is 120 mm into the ground, where the soil stays near 30 °C on a summer day (est.), so the ground is the heat sink. About 49 °C at the chip in full sun (est.).

5. Power budget (est.)

Item	Plate	Base
In play	3.0 W (RV1126B, two cameras at 120 fps, radar, Wi-Fi, BLE)	0.7 W (ESP32-S3, OV2640 at 30 fps, BLE, foot sensors)
Between games	0.3 W	0.15 W
Cells	4 × 18650	2 × 18650
Worst-case day (aged to 80 %, 5 °C)	about 12.4 h for a 10 h tournament day	about 26 h

6. Factory test (every board, every time)

Spring-pin fixture on the factory pads (no factory connector): rails and current, boot from the card, both camera chips streaming at 120 fps with the sync line, the radar’s self-test, the light, the tone, the tamper switch, the security chip, a BLE link to a test base; on the base board the camera, mic, four foot-sensor inputs and the charger.

7. Who makes what

One rigid-flex maker builds and assembles both boards (the plate board has three bent pieces; the base board one). Underfill under the RV1126B, memory, eMMC and radar chip; conformal coating with the sensors, sockets and antennas masked.

8. Cost per set, electronics (est.)

About $105 for the plate board and $32 for each base board at 1,000 sets (est., from the core boards in products/PCB-PLATFORM.md section 5): about $201 a set, against $1,990 for the set.

9. Timeline

Shape and placement are done (4 Nov 2026). Schematic, footprints and routing follow the CricketOne board; rev A after CricketOne’s rev A.

10. Still to check

The rev T plate CAD: radome and front window wells run out to the front bevel under flush clear PC skins, the heat boss, the tamper post, the zone-head post.
The radar’s pitch speed against a reference gun (it reads from about 2.5 m in).
The base window opened to Ø16 with a chamfer for the wide lens.
Wi-Fi and BLE from the flush plate through the radome skin.

Sources

Design review (4 Nov 2026)

New shared rule (4 Nov 2026, from the CricketOne test-board circuit): every cell pack has its own protector. CricketOne’s circuit puts a protector chip and two FETs on its cells, because the charger only stops charging: a short, too much current or a flat pack needs its own cut-off, at the thresholds of the cells’ chemistry (lesson cellguard, checked by the shared review: one protector for each charger, or a protected cell). The plate’s four-cell pack (U4) and the base’s two-cell pack (U24) had chargers and no protector: both power blocks now carry a TI BQ2970 protector and a dual FET (Samsung 35E cells have none of their own; zones est.).

Every board is checked by the same rules (products/_shared/board-rules.mjs), one for each lesson any of our boards has taught us. DiamondOne’s boards were made with every rule from the start: 29 pass, 4 fixed, 10 to prove, 0 fail. The full review, with every number and its source, is on the board page. It shows:

Cameras: the ball at the top of a tall batter’s zone is 75 px across on the zone camera and 41 px at 2 m on the front camera; both OV9281 chips run their standard 120 fps mode with the global shutter, on one frame-sync line.
Views: every plate call (zone corners for batters 1.50 to 1.87 m, the pitch 1 and 2 m out, the ball off the bat) and every base call is in view from where the chips sit, and every ray passes over the plate’s front edge.
Window (lesson): in rev O the plate’s windows were holes in the middle of the 20 mm top, so a ray 15° up from 7 to 10 mm under the ground hit the top before leaving it. The radome and front window wells now run out to the front bevel under flush clear PC skins (rev T CAD; the skin is tested against spikes and a ball on rev A).
Radar: flush in the ground it reads the pitch from about 2.5 m in, not at release; the release speed is worked back with the drag model and measured against a reference gun.
Clocks and card: MEMS oscillators from the start, a latched microSD on both boards.
Battery: the plate’s four cells give about 12.4 h for a 10-hour tournament day with cells aged and cold (24 % spare); each base’s two cells about 26 h.
Fast lines on a solid ground plane (to prove, lesson: planes, from the CricketOne test-board layout of 4 Nov 2026): RV1126B memory; 4 camera MIPI links (100 Ω pairs); USB (90 Ω); antenna feed (50 Ω, keep-out on every layer); card lines (length-matched, no vias under the socket). Ground on the layer next to the parts (inner layer 1, supply on inner layer 2; the whole bottom of a 2-layer section), one via beside each ground and supply pad and none in pads, no copper or vias in the antenna keep-out on any layer or under the card socket, the impedance lines routed first with a test coupon. The quote asks for it; the routed board’s design rule check proves it.

The request for quote is /build/diamondone-quote.