DiamondOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-DO-PB-A

We are asking for a turnkey quote: finish the design of our plate board and base board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from its battery, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/diamondone-boards.

1. The board

Two rigid-flex boards. Plate board: an 8-layer board cut to the home plate’s shape (340 × 339 mm) with the RV1126B on side A over a heat block, 2 GB LPDDR4X, 32 GB eMMC, MEMS clocks, AP6256 Wi-Fi/BT with a chip antenna, security and ID chips, latched microSD, four soldered 18650 holders with thermistors, BQ24074 charger, latched charge lead, 8 call-light LEDs, sounder, tamper switch; a 20 × 20 zone head on a 10 mm flex tail with an OV9281 and M12 lens holder; a 32 × 59 radar tab with the TI IWR6843AOP and a 24 × 54 front tab with an OV9281 and M6 lens holder, both bent up and back to 30° above level. Base board (three per set): a 4-layer 300 × 320 board with the ESP32-S3-WROOM-1 module, security and ID chips, latched microSD, BQ24074 charger, two soldered 18650 holders with a thermistor, latched charge lead, four foot-sensor pad pairs and a tamper switch, and a 200 × 79 front strip bent 90° up with the OV2640 and M7 lens holder, a MEMS mic, a sounder and 8 call-light LEDs.

The outline, sections and placement of all 73 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Rockchip RV1126B, 3 TOPS NPU, ISP, 2 × MIPI CSI-2 (both OV9281 chips), on side A over the tub-floor boss	plate
HB1	Copper heat block 16 × 16 × 12 with a 1 mm gap pad, from U1 down to a 39 mm cast boss on the tub floor (rev T): the ground under the plate is the heat sink	plate
U10	LPDDR4X 2 GB (clips of unsure calls, the two camera pipelines)	plate
U5	eMMC 32 GB (shipped empty, so the card always starts first; our loader on the card reads the card first; keeps the match log)	plate
U3	Rockchip RK806 class PMIC for the RV1126B rails	plate
Y1	MEMS oscillator 24 MHz (SiTime SiT8008 class), rated 50,000 g	plate
Y2	MEMS oscillator 37.4 MHz for the Wi-Fi/BT module (SiTime SiT8008 class)	plate
BT1	Keystone 1042 SMT holder for one 18650 cell (Samsung INR18650-35E), 1S4P pack, left back	plate
BT2	Keystone 1042 SMT holder, 18650, left front	plate
BT3	Keystone 1042 SMT holder, 18650, right back	plate
BT4	Keystone 1042 SMT holder, 18650, right front	plate
RT1	NTC thermistor 10 k, 0603, between the left cells, read by the charger so charging holds outside 0–45 °C	plate
RT2	NTC thermistor 10 k, 0603, between the right cells	plate
TP1	Factory pads: USB (RV1126B), serial console, boot, reset, rails, current sense	plate
U6	AMPAK AP6256 Wi-Fi 5 + BT 5 module (the app; the bases’ BLE links)	plate
AE1	Dual-band chip antenna under the radome well (the plate is cast aluminium; the radome is its only radio window)	plate
U2	Microchip ATECC608B, UDFN-8: signs every call	plate
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	plate
J2	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card	plate
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	plate
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	plate
J1	Molex Micro-Fit 3.0 vertical header, 2 circuits, latched: the lead to the sealed M8 charge socket in the tub wall under a rubber cap	plate
U4	Charge input with TVS and reverse block; TI BQ24074 1.5 A charger with power path (NTC input); TI TPS63020 3.3 V buck-boost; rails for the radar; TI BQ2970 1-cell Li-ion protector + dual N-FET on the pack (short, over-current, over-discharge cut-off at 2.8 V)	plate
U7	Level shifter for the call-light data line (3.3 to 5 V)	plate
LS1	Magnetic sounder 12 × 12 SMD under the tone holes (the call tone), with a printed sound tube to the top	plate
GK1	Printed sound tube Ø10 from the sounder to the tone holes, with a mesh at the top	plate
SW1	Omron D2F-01, plunger up, pressed by a post on the bolted top’s underside (rev T) when the top is screwed down	plate
LP1	Printed clear light guide from the 8 LEDs up to the clear call-light strip in the top	plate
U11	OmniVision OV9281 1 MP global-shutter camera chip, 1280 × 800 at 120 fps, 2-lane MIPI, frame-sync input; looks straight up the strike zone	zhead
L1	M12 lens holder and a 2.1 mm wide lens, about 72° × 52° (the CAD’s zone corners need 66° × 52°)	zhead
U8	TI IWR6843AOP 60 GHz radar, antennas in the package (3 TX, 4 RX): every pitch’s speed and the ball off the bat	rtab
U12	QSPI flash 2 MB and the radar’s 40 MHz MEMS oscillator (SiTime SiT8008 class)	rtab
U13	OmniVision OV9281 1 MP global-shutter camera chip, 1280 × 800 at 120 fps; looks 30° up at the pitcher: the last 2 m of every pitch, the first 1.5 m off the bat	ftab
L2	M6 lens holder and lens, about 60° × 45°, its front up in the front well	ftab
U21	Espressif ESP32-S3-WROOM-1-N16R8: ESP32-S3, 16 MB flash, 8 MB PSRAM (camera frames, clips), PCB antenna, certified; antenna end at the right edge (the base is foam over a plastic tray)	base
U22	Microchip ATECC608B: signs every call	base
U29	ID EEPROM 2 kbit	base
J22	microSD socket with a hinged, latched lid (Amphenol 101-00660 class): our software starts from the card	base
U93	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	base
U92	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	base
J21	Molex Micro-Fit 3.0 vertical header, 2 circuits, latched: the lead to the sealed M8 charge socket in the tray’s back face	base
U24	TI BQ24074 1 A charger with power path (NTC input); TI TPS63020 3.3 V buck-boost; TI BQ2970 1-cell Li-ion protector + dual N-FET on the pack (short, over-current, over-discharge cut-off at 2.8 V)	base
BT21	Keystone 1042 SMT holder, 18650 (Samsung INR18650-35E), back	base
BT22	Keystone 1042 SMT holder, 18650, front	base
RT21	NTC thermistor 10 k, 0603, between the cells	base
SW21	Omron D2F-01, plunger up, pressed by a post under the tray lid (rev T)	base
U27	Level shifter for the call-light data line	base
PD21	Two solder pads for foot sensor 1’s tail (Alpha MF02A FSR), a divider to an ADC pin, strain-relief slot beside them	base
PD22	Two solder pads for foot sensor 2’s tail (Alpha MF02A FSR), a divider to an ADC pin, strain-relief slot beside them	base
PD23	Two solder pads for foot sensor 3’s tail (Alpha MF02A FSR), a divider to an ADC pin, strain-relief slot beside them	base
PD24	Two solder pads for foot sensor 4’s tail (Alpha MF02A FSR), a divider to an ADC pin, strain-relief slot beside them	base
TP21	Factory pads: USB (ESP32-S3 native), boot, enable, rails	base
U23	OmniVision OV2640 2 MP camera chip, SVGA at 30 fps over its 8-bit port to the ESP32-S3, frame time-stamped to the plate’s clock	bfront
L3	M7 lens holder and a wide lens, about 100° × 75°, its front 0.3 mm inside the Ø12 window	bfront
MK21	Infineon IM69D130 MEMS mic, bottom port over a Ø1 hole (the glove pop, the bat crack)	bfront
GK21	Silicone sound gasket Ø5 from the strip hole to the mic port	bfront
LS21	Magnetic sounder 12 × 12 SMD on the tone holes	bfront
D1	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D2	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D3	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D4	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D5	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D6	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D7	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D8	RGB LED with driver, 5050 (WS2812B class), under the plate’s light guide	plate
D21	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront
D22	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront
D23	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront
D24	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront
D25	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront
D26	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront
D27	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront
D28	RGB LED with driver, 5050 (WS2812B class), behind the base’s clear strip	bfront

Each part’s size, side and position is in diamondone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RV1126B reference design and Espressif’s ESP32-S3 hardware design guide and our block list. We review it before layout.
2. Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Underfill under U1, U10, U5, U8, and flexible-termination capacitors near the board edges (the product takes shocks of about 1000 g). Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK, with a real-time (PREEMPT_RT) kernel and the cameras’ frame-sync inputs. A Rockchip SDK image must start from the microSD card. Camera drivers: zone camera OV9281 at 1280 × 800, 120 fps; front camera OV9281 at 1280 × 800, 120 fps; base camera (each base) OV2640 at 800 × 600, 30 fps. Flash our ESP32-S3 image (we send it). We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J2, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

Please quote both battery options:

• A: cells fitted. 4 × Samsung INR18650-35E soldered to the pack pads, protection checked, charged to storage level, and shipped as cells in equipment (UN3481). Please tell us your rules for this.
• B: cells not fitted. A short, polarised battery lead and plug on the pack pads, plus one charged pack per board. Nothing else to do on our side.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Zone camera: OV9281 streams 1280 × 800 at 120 fps with no lost frames over 10 minutes, and a frame of a test chart is saved; the frame-sync input triggers frames.
5. Front camera: OV9281 streams 1280 × 800 at 120 fps with no lost frames over 10 minutes, and a frame of a test chart is saved; the frame-sync input triggers frames.
6. Base camera (each base): OV2640 streams 800 × 600 at 30 fps with no lost frames over 10 minutes, and a frame of a test chart is saved; the frame-sync input triggers frames.
7. Radios: U6 (AMPAK AP6256 Wi-Fi 5 + BT 5 module); U21 (Espressif ESP32-S3-WROOM-1-N16R8): each joins or answers a test station.
8. Sensors and outputs, each read or driven in turn: U91, U93 (microSD ESD and filter array), LS1 (Magnetic sounder 12 × 12 SMD under the tone holes), U8 (TI IWR6843AOP 60 GHz radar), U12 (QSPI flash 2 MB and the radar’s 40 MHz MEMS oscillator), MK21 (Infineon IM69D130 MEMS mic), LS21 (Magnetic sounder 12 × 12 SMD on the tone holes), D1–D28 (RGB LED with driver).
9. Battery: charges from the charge input at the set voltage; protection cuts off at low voltage and on a short; the gauge reads charge; the thermistor reads.
10. Power: the draw in each state of our day (in play about 3 W, between games about 0.3 W), so we can check our design review: at least 10 hours, cells aged and cold.
11. Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	2 and 6: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 29 pass, 4 fixed by the review, 10 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Ball-grid chips
• Card grade
• Wi-Fi and BLE from the plate
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Radome and front window run out to the front bevel
• Pitch speed from the plate
• Base camera through its Ø12 window
• Heat boss and tamper posts

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]