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IEMI Labs
ClassOne

Our own circuit boards, in the classroom whiteboard

Boards we design for the smart whiteboard, with every chip soldered on them: the RK3576J processor and its memory, two room camera chips, the 96-LED time bar, the Wi-Fi module, the mic, the speaker amp, the security chip, a CO2 chip and the tap-in reader. One rigid-flex piece lies in the header rail behind the opal cover; a small air board sits in the side frame at the height the California rule asks for, and a tray board under the pen tray lid, both on one latched bus. No bought modules, ribbons or adapters; only 5 V in the board.

Stage 1 of 6 done: shape and placementNot yet ready to manufactureUpdated 4 November 2026 · rev A-0

The board in 3D

Every part at its real size, in its real place. Turn it, zoom in, switch between the boards in the whiteboard and laid flat, and click any part to see what it is. The chip bodies are simple blocks until each part's own 3D model is added.

Loading the 3D board…

Drag to turn · scroll to zoom · right-drag to move · click a partDrag to turn · tap a part

Where everything is in the whiteboard

Room camerasheader rail

Two bare Sony IMX415 camera chips on small tabs off the main board, each under an M12 lens that passes through the header cover to just inside its face, turned 30° out and 20° down: every desk, the back corners, the group table and the door. They count heads, never faces, and keep no picture.

Time barbehind the cover

A long light strip stands just behind the opal cover with 96 colour LEDs in one row: the lesson timer running down green, amber and red, the reading-group colours, and the register and air calls.

Processor, radio and securityheader rail

The RK3576J with its memory on the main board, a heat block into the aluminium rail, the Wi-Fi module behind the opal, the security chip that signs every call, the latched microSD card with our software, and a tamper sensor held by a magnet in the cover.

Mic and speakerrail floor

A MEMS mic on a small tab over the rail’s mic port hears the sound level and the fire-alarm tone only, never words; the speaker amp drives the speaker over the floor grille.

CO2left side frame

A small air board in the side-frame pocket, 4.5 ft up as the California rule asks, carries the CO2 chip behind the vent slots: it calls ‘open the window’.

Tap-inpen tray

A tray board under the tray lid with an NFC chip and a printed coil, where pupils tap their cards for the register check. It hangs on the same latched bus as the air board, down the side frame.

The whiteboard boards laid flat, both sides, every part at its real size

Laid flat: the mic tab on its tail, the main board with the camera tabs in front and the light strip above on F1; then the inlet tab, the air board and the tray board. Tap the drawing to open it full size.

Design review: checked before we order

Every board-level number ClassOne's jobs depend on, checked against its target with the source of each number, using the rules every one of our boards shares (products/_shared/board-rules.mjs). Fixed means a lesson changed this board; to prove means it passes on paper and is measured on rev A before boards are ordered.

No check fails16 pass · 3 fixed by the review · 12 to prove before we order · 0 failDesign review of 4 November 2026
AreaCheckOur boardTargetStatus
CameraLeft room camera: a pupil's head (150 mm) at the back seat at 7.58 m
M12 lens, 102° across: about 37.6 px per degree across 3840 px. The person counter is trained on heads from about 20 px (est.); it counts heads, never faces, and keeps no picture.
42.7 px≥ 20 pxpasses
CameraLeft room camera: frame rate the calls need
A standard mode of the IMX415.
1 fps at 3840 × 2160chip: 30 fps at 3840 × 2160passes
CameraLeft room camera: data rate vs its 4-lane link
98 % spare on the link.
0.08 Gbps (10-bit)≤ 80 % of 3.564 Gbpspasses
CameraRight room camera: a pupil's head (150 mm) at the back seat at 7.58 m
M12 lens, 102° across: about 37.6 px per degree across 3840 px. The person counter is trained on heads from about 20 px (est.); it counts heads, never faces, and keeps no picture.
42.7 px≥ 20 pxpasses
CameraRight room camera: frame rate the calls need
A standard mode of the IMX415.
1 fps at 3840 × 2160chip: 30 fps at 3840 × 2160passes
CameraRight room camera: data rate vs its 4-lane link
98 % spare on the link.
0.08 Gbps (10-bit)≤ 80 % of 3.564 Gbpspasses
CameraImage processor load, all cameras
2 cameras into one image processor.
17 Mpx/s≤ 480 Mpx/s (RK3576J ISP)passes
CameraAI engine time per frame
One person counter (int8) on the two 8 MP views, merged; the mic level and the CO2 are read by the CPU. Measured on the dev kit.
6 TOPSa head count from both views in under 2 s every 10 s, the group-table check at the same timeto prove on the dev kit
PowerSupply
About 5 W counting (RK3576J 3 W, two cameras 0.6 W, Wi-Fi 0.5 W, CO2, tap-in and mic 0.4 W), the time bar capped at 4 W by its 1 A limit and the firmware, 1.5 W speaker peaks (est.): 10.5 W, 70 % of the adapter.
a listed USB-C adapter giving 5 V 3 A (SELV) at the wall socket beside the board, into the inlet tab at the rail's right end≤ 70 % of the adapter (15 W)passes
PowerPower cut
Pulling the adapter mid-count is part of the rev A tests.
no cells: a power cut stops the board; the register log is written to eMMC on every change and signedno lost register or air log in a power cutto prove on the dev kit
HeatRK3576J temperature, a sunny classroom in June (30 °C) with the heating or the sun on the wall
The header rail sits near the ceiling, where the room is warmest; counted at 40 °C inside. 3 W through a 24 × 24 aluminium block and gap pads to the 2.4 m aluminium header rail (4 K/W, est.).
52 °C≤ 85 °C (rated)passes
HeatCamera chips away from the processor
A warm sensor adds noise to dim winter mornings.
left camera 157 mm, right camera 61 mm from the RK3576J≥ 30 mmpasses
ShockShock and vibration
A foam ball thrown at the board in wet play, about 20 J on the cover (est.); the boards are on stand-offs in the rail, 2 m up. MEMS clocks are fitted anyway, and the card socket is latched.
50 g (est.)standard partspasses
SoftwareStarts our software from the microSD card, no setup
Owner requirement: power it from its own supply and our software runs from the card. Rev A and sale boards boot from the card; the eMMC holds no system copy (it ships empty, so the card always starts first: Rockchip tries the eMMC before the card) and keeps the day log. Updates write to the card with two system copies, only after school hours and never during a lesson. The quote asks for U-Boot and a device tree from Rockchip's RK3576 SDK.
microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the cardcard socket fitted on every board, latchedpasses
SoftwareCard power switch and protection
A card that hangs must be restarted by cutting its power, not the whole board; the card slot is the one place a person touches the electronics (lesson: sdstart). Change: U90, U91 added (4 Nov 2026, CricketOne card-start review).
1 power switch and 1 ESD array for 1 card socketevery socket: switched card supply, ESD on all 6 linesfixed by the review
SoftwareThe card wins the start
Rockchip's start order is SPI flash, eMMC, card, USB: a written eMMC starts before the card. Proved on the dev kit: power on with a card in and the eMMC empty (lesson: sdstart). Change: eMMC ships empty and the loader reads the card first (4 Nov 2026; it used to say the eMMC kept a copy, which would have started instead of the card).
eMMC shipped empty; our loader reads the card firstthe processor starts from the card every timefixed by the review
SoftwareCard grade
Consumer cards wear out and fail hot; the image is read-only with a separate data partition. Proved: 1,000 power cuts during writes on rev A (lesson: sdstart).
industrial pSLC microSD (Kingston Industrial or Swissbit S-56u), −40 to 85 °Crated for the heat, cold and writesto prove on the dev kit
SoftwareClip buffer for an unsure call
The rest of the memory holds Linux, the program and the AI model (lesson: clip).
98.8 s of 8-bit 1 fps video in 40 % of the 2 GB memory≥ 3 spasses
RadioWi-Fi from inside an aluminium header rail
The rail is aluminium on three sides; only the opal front lets radio out, so the antenna sits right behind it. Measured on rev A (lesson: antenna).
Wi-Fi 6 module on the light strip, its chip antenna 4 mm behind the opal cover, between the rail's top and bottom lipscertified Wi-Fi module, the school's WPA3-Enterprise Wi-Fito prove on the dev kit
LayoutFast lines on a solid ground plane
The layout rules go to the maker in the quote; the routed board's design rule check (0 copper errors, every keep-out kept) and the maker's impedance coupon prove them (lesson: planes).
RK3576J memory; 2 camera MIPI links (100 Ω pairs); USB (90 Ω); antenna feed (50 Ω, keep-out on every layer); card lines (length-matched, no vias under the socket)ground on inner layer 1, supply on inner layer 2, no vias in pads, impedance lines routed firstto prove on the dev kit
MoistureConformal coating
Board wipes and cleaning spray reach the tray and the cover every day; all six boards get the same coat. Asked for in the quote (lesson: moisture).
coatedcoated, sensors, sockets and antennas maskedpasses
FitBoard inside the product CAD, every part checked in 3D
The board is checked on its own; the rev T CAD run places it in the product and checks every part in 3D (lesson: fit3d).
not yet in the product CADnothing touchesto prove on the dev kit
CameraEvery head-count, room-clear and group call in a camera view
Every inView target from the CAD (front and back desks on each side, the centre, the back corners, the group table, the door) from the lens front's real place in the cover.
Left room camera: worst 30.7° / 21.7°; Right room camera: worst 43.6° / 21.7°inside the 102 × 69.6° viewpasses
CameraCamera windows in the header cover
The bench windows were 30 × 30 round the Camera Module boards. Our lens passes through the cover to 0.5 mm inside its face, but the line of sight to a door at the front corner runs 80° from the cover, so the far side of the lens rim needs the window to open outward (lesson: window). Both windows open outward, because the door can be on either side of a real classroom. Change: CAD rev T: camera windows 30 × 30 → 63 × 34, opening outward (4 Nov 2026).
left view reaches 17.5 mm out from its axis, right 41.6 mm (the door, 80° from the cover); margins 6.7 and 1.5 mmrev T windows 63 × 34, x ±42 to ±105fixed by the review
FitCamera tabs on their brackets
Each tab hangs off the main board's front edge and is held on its camera's axis by a printed bracket clipped to the rail floor; the brackets go in the rev T CAD and are checked in 3D there (lesson: fit3d).
Left room camera: holder 0.3 mm behind the cover, barrel 6 mm, hinge 22.9 mm, lowest corner 2026.5 mm; Right room camera: holder 0.3 mm behind the cover, barrel 6 mm, hinge 22.9 mm, lowest corner 2026.5 mmholder ≥ 0.3 mm off the cover, hinge within the 25 mm flex, clear of the rail floor and the light stripto prove on the dev kit
LightTime bar behind the opal cover
The bench used 12 bought LED sticks; on our strip the LEDs sit in one row. The evenness through the opal and the brightness at the back seat are checked on rev A.
96 RGB LEDs at 6.4 mm pitch across the 614 mm bar, 4 mm behind the cover; 1 A limitone even bar seen from the back of the room; never glaringto prove on the dev kit
SensorsCO2 chip where the California rule puts it
The bench SCD30 module (±60 ppm at 1,000 ppm) is replaced by the SCD43 chip soldered on our air board; its accuracy is taken from Sensirion's datasheet (est. ±(30 ppm + 3 %), to read) and checked against a reference meter on rev A.
Sensirion SCD43 in the left side-frame pocket, 1,388 mm (4.5 ft) up, behind the vent slots3 to 6 ft up, 5 ft from doors and windows (PUC 1625); ±75 ppm at 1,000 ppmto prove on the dev kit
SensorsTap-in through the tray lid
The bench PN532 module sat under the same lid; the coil is tuned on rev A with the lid and the aluminium tray round it.
NXP PN7160 with a 40 × 35 printed coil 3 mm under the 3 mm PETG lidan NTAG215 card read at 20 mm or more, every tapto prove on the dev kit
FitLeads and the bus
The CO2 chip must sit 3 to 6 ft up and the tap-in at a child's reach, 1.2 m below the header, so the air and tray boards hang on one latched, keyed bus in the side frame's channel; the inlet is at the rail's end beside the wall socket.
L1 about 1.08 m of 18 AWG, 0.1 V drop at 2.1 A; L2 + L3 about 2.46 m of 26 AWG, 0.27 V drop at the trayL1 ≤ 0.15 V; tray ≥ 3.8 V for its 3.3 V supply; differential I²C ≤ 3 m (est.)passes
SecurityCover and tray-lid tamper sensors
The bench used a plunger switch pressed by the cover; on our board a Hall switch needs no boss. The magnet pockets go in the rev T CAD and the switch point is measured on rev A.
DRV5032 Hall switches 4 mm behind the header cover and under the tray lid, each held by a Ø6 × 3 magnet bonded in the cover or lidcover or lid opened = logged and signedto prove on the dev kit
FitFlex lengths
F1 carries the time-bar data and the Wi-Fi module's SDIO; the flex maker confirms the SDIO impedance over that length.
F1 61 mm up to the light strip; mic tail 163 mm along the rail floorrouted and held in the rev T CADto prove on the dev kit

Before we order the first boards, we prove these on the RV1126B development kit or in the rev A tests:

  1. AI engine time per frame
  2. Power cut
  3. Card grade
  4. Wi-Fi from inside an aluminium header rail
  5. Fast lines on a solid ground plane
  6. Board inside the product CAD, every part checked in 3D
  7. Camera tabs on their brackets
  8. Time bar behind the opal cover
  9. CO2 chip where the California rule puts it
  10. Tap-in through the tray lid
  11. Cover and tray-lid tamper sensors
  12. Flex lengths

Where the design stands

  1. 1Shape and placementdone

    Main board, camera tabs, light strip, mic tab, inlet tab, air board and tray board in the whiteboard’s shape, all 144 parts placed at their real size, every room call checked from where each lens sits, and KiCad design rule check (0 violations).

  2. 2Schematicnext

    Every wire between the chips, from the V2 core and C1 camera circuits.

  3. 3Footprintsnext

    The exact solder pads under each chip.

  4. 4Routinglater

    Copper tracks on all layers, along the long light strip and the flexes.

  5. 5Files for the makerlater

    Gerbers with copper, drill, mask, paste, the rigid-flex drawing, the lead drawings and the assembly parts list. These go to the board maker.

  6. 6Rev A boardsMar 2027

    Made, assembled and tested on our fixture.

Design files (rev A-0)

These are the stage 1 files: the board's shape and where every part goes. A board maker needs the stage 5 files to build it.

Who can make it

The whiteboard set is an 8-layer rigid-flex piece with a 640 mm light strip, plus three small boards and three leads made to length. It needs a maker who builds rigid-flex boards with long panels and fine-pitch ball-grid chips. We plan three quotes once the stage 5 files are ready: two from China for price, and one from the US for speed.

MakerWhereRigid-flexHDI / layersAssemblyFit for us
PCBWayfirst quoteShenzhen, Chinayes, 6 to 16 layersHDI up to 32 layers, 0.35 mm BGA pitchyes, turnkey, incl. BGA and X-rayBest fit for rev A: the rigid-flex board and its assembly in one order
NextPCBsecond quoteShenzhen, ChinayesHDI, 6 to 32 layersyes (PCBA)Second quote, to compare price and lead time
ALLPCBChina (a network of partner factories)yes, through partner factories1 to 30 layersyesThird quote; check which factory builds it
JLCPCBShenzhen, Chinano (flex only: 1, 2 and 4 layers, up to 490 mm)HDI added Sep 2026yes, incl. BGANot for the one-piece board today. Good for the test fixture, simple boards, and the fallback of separate rigid boards joined by soldered flex
Sierra Circuits (ProtoExpress)US quoteSunnyvale, California, USAyesyesyes, in-house, incl. BGA; turnkey in about 5 daysUS option: fastest turn and engineering help, at a higher price
CirexxSanta Clara, California, USAyesyesyes (turnkey or consigned)Second US option
Advanced CircuitsAurora, Colorado, USAyescheckyesUS quick-turn; check its rigid-flex assembly
EpecNew Bedford, Massachusetts, USAyescheckyes; also builds battery packsUS option that can also make a certified LiFePO4 pack

From each maker's own capability pages, checked 3 November 2026. Limits change, so each quote confirms them for our exact stack-up.

Full design notes

All 144 parts, what is on each board, every connection, heat, power, the factory test, cost and timeline.