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IEMI Labs
CellOne

CellOne: one circuit board of our own, shaped to the signal tower

Every part of the smart Ø70 signal tower's electronics on one board we design: the RV1126B chip, memory, Wi-Fi and Bluetooth, the colour camera chip, the heat-camera chip, the mic, the machine's 24 V input with hold-up, isolated tier inputs, the lamps of all four tiers and the sounder. It runs up the tower in one piece, with no plugs, ribbons, adapters or spring contacts inside. Revision A is planned for early 2027.

Updated November 3, 2026 · prototype P1 · tap a drawing to open it full size

The board in 3D

Every part at its real size, folded up the tower: the disc on the floor plate, the camera and heat heads behind their windows, the spine up the centre with a lamp section in each tier. Turn it, switch to laid flat, and click any part to see what it is. Chip bodies are simple blocks; part heights not in the datasheets are est.

Loading the 3D board…

Drag to turn · scroll to zoom · right-drag to move · click a partDrag to turn · tap a part

CellOne board: every part at its real size and place

Design review: checked before we order

Every board-level number CellOne's jobs depend on, checked against its target, using the rules every one of our boards shares. Fixed means a lesson changed this board; to prove means it is measured on rev A before boards are ordered.

No check fails9 pass · 5 fixed by the review · 5 to prove before we order · 0 failDesign review of 4 November 2026
AreaCheckOur boardTargetStatus
CameraColour camera: a dial face (60 mm) on the machine at 2 m
M12 wide lens, about 105° across (est.): about 24.7 px per degree across 2592 px. It reads dials with coloured bands, the part bin and the operator side.
42.4 px≥ 30 pxpasses
CameraColour camera: frame rate the calls need
A standard mode of the IMX335.
2 fps at 2592 × 1944chip: 30 fps at 2592 × 1944passes
CameraColour camera: data rate vs its 2-lane link
95 % spare on the link.
0.1 Gbps (10-bit)≤ 80 % of 2 Gbpspasses
CameraHeat camera: one heater band (60 mm) on the barrel at 1.5 m
32 × 24 pixels across 110°: 0.3 px per degree. A band is less than one heat pixel, so it is not seen as a shape: a band that fails cools from about 230 °C, and covering half a pixel or more it moves that pixel by tens of degrees, enough to call it.
0.7 px≥ 0.5 pxpasses
CameraImage processor load, all cameras
1 camera into one image processor.
10 Mpx/s≤ 360 Mpx/s (RV1126B ISP)passes
CameraAI engine time per frame
Light work for the AI engine. Measured on the dev kit.
3 TOPSdial and bin models at 2 fpsto prove on the dev kit
PowerSupply
Running 3.0 W, calling 4.2 W (est.).
the machine's 24 V tower feed (19.2–30 V)the IEC 61131-2 rangepasses
PowerPower cut
Measured on rev A when the machine is switched off.
supercapacitors keep the brain alive about 2 s (est.)sign the power-off event and close filesto prove on the dev kit
HeatRV1126B temperature, a 40 °C machine shop
The base disc on its 3 mm aluminium floor plate, about 8 K over the air (est.). 3 W through the floor plate (6 K/W, est.).
66 °C≤ 85 °C (rated)passes
ShockShock and vibration
Fixed to the machine: vibration, not blows (est.). The latched card socket still keeps the card in.
50 g (est.)standard partspasses
SoftwareStarts our software from the microSD card, no setup
Owner requirement: power it from its own supply and our software runs from the card. Rev A and sale boards boot from the card; the eMMC holds no system copy (it ships empty, so the card always starts first: Rockchip tries the eMMC before the card), and Wi-Fi updates write to the card with two system copies. The quote asks for U-Boot and a device tree from Rockchip's RV1126B SDK. Change: J1 is a hinged, latched microSD fitted on every board (4 Nov 2026).
microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the cardcard socket fitted on every board, latchedfixed by the review
SoftwareCard power switch and protection
A card that hangs must be restarted by cutting its power, not the whole board; the card slot is the one place a person touches the electronics (lesson: sdstart). Change: U90, U91 added (4 Nov 2026, CricketOne card-start review).
1 power switch and 1 ESD array for 1 card socketevery socket: switched card supply, ESD on all 6 linesfixed by the review
SoftwareThe card wins the start
Rockchip's start order is SPI flash, eMMC, card, USB: a written eMMC starts before the card. Proved on the dev kit: power on with a card in and the eMMC empty (lesson: sdstart). Change: eMMC ships empty and the loader reads the card first (4 Nov 2026; it used to say the eMMC kept a copy, which would have started instead of the card).
eMMC shipped empty; our loader reads the card firstthe processor starts from the card every timefixed by the review
SoftwareCard grade
Consumer cards wear out and fail hot; the image is read-only with a separate data partition. Proved: 1,000 power cuts during writes on rev A (lesson: sdstart).
industrial pSLC microSD (Kingston Industrial or Swissbit S-56u), −40 to 85 °Crated for the heat, cold and writesto prove on the dev kit
RadioWi-Fi/BT module clock
The AP6256 runs from its own 37.4 MHz reference clock; a wrong or missing clock means no Wi-Fi or Bluetooth at all (lesson: wificlock). Change: the AP6256 had no clock on the board; Y3, a 37.4 MHz MEMS oscillator, added next to it (4 Nov 2026, from the CricketOne test-board circuit).
37.4 MHz MEMS oscillator (Y3)37.4 MHz next to the AP6256fixed by the review
RadioWi-Fi to the shop's access point
The base disc sits on an aluminium floor plate on a steel machine. Measured on rev A (lesson: antenna).
across a machine shopcertified Wi-Fi 5 moduleto prove on the dev kit
LayoutFast lines on a solid ground plane
The layout rules go to the maker in the quote; the routed board's design rule check (0 copper errors, every keep-out kept) and the maker's impedance coupon prove them (lesson: planes).
RV1126B memory; 1 camera MIPI link (100 Ω pairs); USB (90 Ω); antenna feed (50 Ω, keep-out on every layer); card lines (length-matched, no vias under the socket)ground on inner layer 1, supply on inner layer 2, no vias in pads, impedance lines routed firstto prove on the dev kit
MoistureConformal coating
Coolant mist and dust around machines. Asked for in the quote (lesson: moisture).
coatedcoated, sensors, sockets and antennas maskedpasses
FitBoard inside the product CAD, every part checked in 3D
The folded board from the 3D model is placed in the product CAD and every part is checked against every wall and bought part that stays. Change: In the rev T tower CAD the camera lens holder and lens reached into the wall (175 mm³): the 45° axis left the wall 14 mm below the window. The camera head moved up and in onto the axis (y 12.9, z 119.1), the riser grew 40 mm, and the board code checks the axis, lens rim and holder corners in 3D, 0.5 mm from the wall (3 Nov 2026).
no part touches a wall or a bought part (2026-11-03)nothing touchesfixed by the review

Before we order the first boards, we prove these on the RV1126B development kit or in the rev A tests:

  1. AI engine time per frame
  2. Power cut
  3. Card grade
  4. Wi-Fi to the shop's access point
  5. Fast lines on a solid ground plane