CellOne board: request for quote
From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-C1-ST-A
We are asking for a turnkey quote: finish the design of our signal-tower board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from a 24 V bench supply, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.
All files are in the design pack (zip). The board, part by part: iemilabs.com/build/cellone-boards.
1. The board
One rigid-flex board up the Ø70 signal tower: an 8-layer Ø60 base disc (RV1126B, memory, storage, Wi-Fi/BT, the M12 machine socket, 24 V input with hold-up, isolated tier inputs, lamp drivers), a riser to the colour camera head, a tamper tab, a wall flex to the heat head and mic tip, and a centre spine with the four lamp sections and the cap tab.
The outline, sections and placement of all 70 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.
2. Parts
| Ref | Part | Where |
|---|---|---|
| U1 | Rockchip RV1126B-P, FCCSP-409, 0.65 mm pitch; thermal pad to the aluminium floor plate | disc |
| U2 | LPDDR4X 8 Gbit ×32 (1 GB), 200-ball FBGA | disc |
| J2 | M12 8-pin A-coded male PCB receptacle, rear mount, through the base floor (Murrelektronik 7000-R2118-11A2400 class) | disc |
| U10 | eMMC 5.1 8 GB industrial, 153-ball FBGA; shipped empty (the processor tries the eMMC before the card, so an image here would win): our loader on the card is set to read the card first | disc |
| J1 | microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card | disc |
| U90 | microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled | disc |
| U91 | microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line | disc |
| TP1 | Factory pads: USB 2.0, debug serial, boot, rails, current sense | disc |
| C1 | RV1126B decoupling field (under the chip) | disc |
| U3 | Power: rails for the RV1126B (core, NPU, logic, DDR, 1.8/3.3 V) from 5 V + inductors | disc |
| U5 | AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module (certified) | disc |
| Y3 | 37.4 MHz MEMS oscillator for the AP6256 Wi-Fi/BT module (SiTime SiT8008 class, shock-rated) | disc |
| U40 | TI LMR36015 buck 4.2–60 V to 5 V, 1.5 A + inductor and caps | disc |
| U41 | 24 V input: 33 V surge suppressor, reverse-polarity FET, fuse | disc |
| U42 | TI TPS61094 supercapacitor charger and booster | disc |
| CS1 | Supercapacitor 3.3 F 2.7 V, Ø8 × 13 lying down (hold-up) | disc |
| CS2 | Supercapacitor 3.3 F 2.7 V, Ø8 × 13 lying down (hold-up) | disc |
| U44 | TI ISO1212 dual isolated 24 V input (red, yellow lines) | disc |
| U45 | TI ISO1212 dual isolated 24 V input (green, blue lines) | disc |
| U46 | TI TPS3431 watchdog (lamp fall-back) | disc |
| U47 | Quad 2-to-1 logic switch: tier line or brain to each lamp driver | disc |
| U48 | 4-channel constant-current LED driver + sounder driver | disc |
| U7 | LSM6DSOX motion sensor (cycles, knocks, tower strikes) | disc |
| U8 | ATECC608B security chip | disc |
| U9 | ID EEPROM 2 kbit | disc |
| Y1 | 24 MHz crystal | disc |
| Y2 | 32.768 kHz RTC crystal | disc |
| SW1 | Omron D2F-01 tamper switch, pressed by a rib on the sensor tier | tamp |
| LH1 | M12 lens holder over the camera chip (2 screws), wide lens about 100–110° (est.) | camHead |
| U20 | Sony IMX335LQN-C 5 MP colour camera chip, 88-pin CSP BGA | camHead |
| U21 | Camera LDO 2.9 V (analog) | camHead |
| U22 | Camera LDO 1.8 V (I/O) | camHead |
| U23 | Camera LDO 1.2 V (core) | camHead |
| Y20 | Camera 37.125 MHz oscillator | camHead |
| U24 | Melexis MLX90640ESF-BAA heat-camera chip, 110° × 75°, TO-39 can (leads through the board) | heatHead |
| U25 | MLX90640 3.3 V LDO and I²C pull-ups | heatHead |
| MK1 | Infineon IM69D130 digital MEMS mic (PDM), bottom port to the mic holes | micTip |
| D1A1 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D1A2 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D1A3 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D1A4 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D1B1 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D1B2 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D1B3 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D1B4 | blue LED, PLCC-2 3.5 × 2.8, tier blue | lamp0 |
| D2A1 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D2A2 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D2A3 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D2A4 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D2B1 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D2B2 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D2B3 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D2B4 | green LED, PLCC-2 3.5 × 2.8, tier green | lamp1 |
| D3A1 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D3A2 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D3A3 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D3A4 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D3B1 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D3B2 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D3B3 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D3B4 | yellow LED, PLCC-2 3.5 × 2.8, tier yellow | lamp2 |
| D4A1 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| D4A2 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| D4A3 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| D4A4 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| D4B1 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| D4B2 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| D4B3 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| D4B4 | red LED, PLCC-2 3.5 × 2.8, tier red | lamp3 |
| LS1 | Magnetic sounder 12 × 12 SMD, under the sound holes | cap |
Each part’s size, side and position is in cellone-board-parts.csv in the pack. Ask before you substitute a part.
3. Scope of work
- Schematic from Rockchip’s RV1126B reference design and our block list. We review it before layout.
- Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
- Fabrication of the rigid-flex board.
- Sourcing of all parts.
- Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
- Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: colour camera IMX335 at 2592 × 1944, 2 fps. We add our own software on top.
- Test of every board to the acceptance list in §5, with a test report per serial number.
- Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.
4. “Ready to run” on delivery
This is the most important part of the job:
- Every board arrives assembled, programmed and tested.
- We put our microSD card in (J1, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
- The ID EEPROM is written with the serial number and board revision.
- The security chip is provisioned per the steps we will send.
5. Acceptance tests (each board, with report)
- Current-limited first power-on: no short, idle current within the agreed limit.
- Rails: every power rail within ±3 %.
- Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
- Colour camera: IMX335 streams 2592 × 1944 at 2 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
- Heat camera: reads a full 32 × 24 frame of a warm target.
- Radios: U5 (AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module): each joins or answers a test station.
- Sensors and outputs, each read or driven in turn: U91 (microSD ESD and filter array), U7 (LSM6DSOX motion sensor), SW1 (Omron D2F-01 tamper switch), MK1 (Infineon IM69D130 digital MEMS mic), D1A1–D1B4 (blue LED), D2A1–D2B4 (green LED), D3A1–D3B4 (yellow LED), D4A1–D4B4 (red LED), LS1 (Magnetic sounder 12 × 12 SMD).
- Power: the draw at idle and at full load from a 24 V bench supply, against our estimate.
- Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.
6. Quantities and timing
| Item | Quantity |
|---|---|
| Rev A boards | 3 and 10: please quote both |
| Budget prices | for 100 and 1,000 boards |
| Quote wanted | within two weeks of this request |
| Boards wanted | please give your lead times for design, fabrication and assembly |
7. Our design review
Before we order, every board-level number is checked against its target: 9 pass, 5 fixed by the review, 5 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:
- AI engine time per frame
- Power cut
- Card grade
- Wi-Fi to the shop’s access point
- Fast lines on a solid ground plane
8. The design pack
Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.
Questions: [email protected]