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IEMI Labs
AthleticsOne

Our own circuit board, up each finish post

One board we design for each finish post, with every chip soldered on it: the camera, the RV1126B processor, the always-on ESP32-S3, Wi-Fi, Bluetooth and the radios, the call lamp and tone, and the battery system. It is rigid where chips sit and flexible where it bends, so it runs up the post in one piece. Both posts carry the same board; the starter unit has a small board of its own. No plugs, ribbons or adapters inside.

Stage 1 of 6 done: shape and placementNot yet ready to manufactureUpdated 3 November 2026 · rev A-0

The board in 3D

Every part at its real size, in its real place. Turn it, zoom in, switch between the board in the home post and laid flat, and click any part to see what it is. The chip bodies are simple blocks until each part's own 3D model is added.

Loading the 3D board…

Drag to turn · scroll to zoom · right-drag to move · click a partDrag to turn · tap a part

Where everything is in the post

Air and black-top heat1,340–1,392 mm

Under the cap: the SHT45 air chip behind the vent and the PT1000 reader for the black-anodised top. Home post only, far above the processor's heat.

Camera1,300 mm

The OV9281 global-shutter camera chip on its own head, under an M8 lens, tilted 10° down to look along the finish line through the camera window.

Call lamp and tone820 and 1,000 mm

Eight LEDs behind the opal lamp slot and a sounder under the tone holes, on the track face where runners and the coach see and hear each call.

Radios640–1,040 mm

Behind the radio window: the always-on ESP32-S3, and on the home post the LTE-M modem, the lightning chip and coil, and the NFC loop drawn in the board copper. The gun mic is on a small tab on the start-side wall at 985 mm.

Brain380–500 mm

The RV1126B processor pressed onto the aluminium track face, with 1 GB memory, 8 GB storage, Wi-Fi and Bluetooth, the motion sensor, security chip and ID chip.

Battery systembase box

The base section lies flat in the steel base: charger, protection, gauge, 5 V boost, the M8 charge socket, the tamper switch, and the dock pins for the starter unit. A flex runs to the four cells.

The post board unfolded, both sides, and the starter board, every part at its real size

Heights are above the track. Tap the drawing to open it full size.

Design review: checked before we order

Every board-level number AthleticsOne's jobs depend on, checked against its target with the source of each number, using the rules every one of our boards shares (products/_shared/board-rules.mjs). Fixed means a lesson changed this board; to prove means it passes on paper and is measured on rev A before boards are ordered.

No check fails18 pass · 5 fixed by the review · 6 to prove before we order · 0 failDesign review of 4 November 2026
AreaCheckOur boardTargetStatus
CameraFinish camera: a runner's torso (0.3 m) in the far lane at 11 m
M8 2.8 mm lens, about 66° across: about 19.4 px per degree across 1280 px. Eight lanes of 1.22 m and the post 1 m off the track.
30.3 px≥ 10 pxpasses
CameraFinish camera: smear at 43 km/h, 0.5 ms exposure
A global shutter freezes the whole frame at once.
6 mm≤ 1/3 of the torso (100 mm)passes
CameraFinish camera: frame rate the calls need
A standard mode of the OV9281.
100 fps at 1280 × 800chip: 120 fps at 1280 × 800, 180 fps at 640 × 400passes
CameraFinish camera: data rate vs its 2-lane link
36 % spare on the link.
1.02 Gbps (10-bit)≤ 80 % of 1.6 Gbpspasses
CameraImage processor load, all cameras
1 camera into one image processor.
102 Mpx/s≤ 360 Mpx/s (RV1126B ISP)passes
CameraCameras in step for timed calls
120 fps gives a frame every 8.3 ms, inside the 0.01 s that results are given to. A real-time (PREEMPT_RT) kernel is asked for in the quote (lesson: sync).
camera frame-sync input on an RV1126B timer pin; the start time from the starter unit over the S1 linktimes to 0.01 spasses
CameraAI engine time per frame
The model size is set by the finish-line work. Measured on the dev kit.
3 TOPStorso finder inside the 8.3 ms frame at 120 fpsto prove on the dev kit
BatteryRun time, 4 cells, worst case (aged to 80 %, 5 °C)
A 10-hour meet (armed 60 % of the day, est.; 400 calls of lamp and tone) uses 18.7 Wh: 2.6 W for 6 h (race armed: RV1126B, camera at 120 fps, Wi-Fi link), 0.25 W for 4 h (between heats: ESP32-S3 awake, RV1126B off), through a 90 % converter. 4 × Samsung INR18650-35E, counted at 3.35 Ah (lesson: battery).
16.4 h≥ 10 hpasses
BatteryRun time, 4 cells, new, 20 °C
New cells at room temperature.
23.3 h≥ 10 hpasses
BatterySpare run time, worst case
Room for the estimate to be wrong.
64 % over 10 h≥ 20 % (the draw is an estimate until rev A)passes
BatteryCharge time
TI BQ24074 1.5 A charger with power path (lesson: charge).
10.3 h from flat at 1.5 A; 9 h overnight puts back 100 % of a daya full day back overnight (9 h)passes
BatteryPeak current from the cells
Inside the cells and the converter.
1.51 A at 2.65 V≤ 32 A (4 × 8 A)passes
BatteryEach pack has its own protector
The charger only stops charging; a short or a flat pack needs its own cut-off, at the thresholds of its chemistry (lesson: cellguard).
2 protectors (U31, BT3) for 2 chargersshort, over-current and over-discharge cut-off on every packpasses
BatteryCharging held outside the cells' temperature range
Lithium cells must not be charged when cold or hot (lesson: charge).
thermistor on the pack, read by the charger0–45 °Cpasses
HeatRV1126B temperature, full sun, 35 °C air
The track-face wall in full sun, about 20 K over the air (est., the post's light finish). 2.6 W through a thermal pad onto the track-face wall (4 K/W, est.).
65 °C≤ 85 °C (rated)passes
HeatCell temperature, full sun, 35 °C air
The cells sit in the steel base box on the track, about 15 K over the air in sun (est.); Li-ion cells run to 60 °C, and charging is held above 45 °C. (lesson: sun).
50 °C≤ 60 °Cpasses
ShockClocks rated for the shock
A post knocked over onto the track, or dropped while carried (est.). Quartz crystals are not rated for that; MEMS oscillators are rated to 50,000 g (lesson: clocks). Change: Y1, Y2 and Y20 are MEMS oscillators (4 Nov 2026, from the CricketOne review).
MEMS oscillatorsevery clock rated for 1000 gfixed by the review
ShockBall-grid chips
Underfill and flexible-termination capacitors are asked for in the quote; the drop tests on rev A prove them (lesson: underfill).
underfill under U1, U2, U10, U5no cracked joints after the drop and hit teststo prove on the dev kit
SoftwareStarts our software from the microSD card, no setup
Owner requirement: power it from its own supply and our software runs from the card. Rev A and sale boards start from the card: the eMMC ships empty and our loader on the card reads the card first (Rockchip tries the eMMC before the card). The quote asks for U-Boot and a device tree from Rockchip's RV1126B SDK, and the maker flashes the ESP32-S3. Change: J2 is a hinged, latched microSD fitted on every board (4 Nov 2026).
microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the cardcard socket fitted on every board, latchedfixed by the review
SoftwareCard power switch and protection
A card that hangs must be restarted by cutting its power, not the whole board; the card slot is the one place a person touches the electronics (lesson: sdstart). Change: U90, U91 added (4 Nov 2026, CricketOne card-start review).
1 power switch and 1 ESD array for 1 card socketevery socket: switched card supply, ESD on all 6 linesfixed by the review
SoftwareThe card wins the start
Rockchip's start order is SPI flash, eMMC, card, USB: a written eMMC starts before the card. Proved on the dev kit: power on with a card in and the eMMC empty (lesson: sdstart). Change: eMMC ships empty and the loader reads the card first (4 Nov 2026; it used to say the eMMC kept a copy, which would have started instead of the card).
eMMC shipped empty; our loader reads the card firstthe processor starts from the card every timefixed by the review
SoftwareCard grade
Consumer cards wear out and fail hot; the image is read-only with a separate data partition. Proved: 1,000 power cuts during writes on rev A (lesson: sdstart).
industrial pSLC microSD (Kingston Industrial or Swissbit S-56u), −40 to 85 °Crated for the heat, cold and writesto prove on the dev kit
SoftwareClip buffer for an unsure call
The rest of the memory holds Linux, the program and the AI model (lesson: clip).
3.3 s of 8-bit 120 fps video in 40 % of the 1 GB memory≥ 3 spasses
RadioWi-Fi/BT module clock
The AP6256 runs from its own 37.4 MHz reference clock; a wrong or missing clock means no Wi-Fi or Bluetooth at all (lesson: wificlock). Change: U11 said a 26 MHz Wi-Fi clock; the AP6256 runs from 37.4 MHz, now a 37.4 MHz MEMS oscillator (4 Nov 2026, from the CricketOne test-board circuit).
37.4 MHz MEMS oscillator (U11)37.4 MHz next to the AP6256, MEMS (shock)fixed by the review
RadioWi-Fi between the two posts
Easy range, but the antenna sits inside the metal post. Measured on rev A (lesson: antenna).
about 11 m across the trackcertified Wi-Fi 5 module, chip antenna behind the radio windowto prove on the dev kit
LayoutFast lines on a solid ground plane
The layout rules go to the maker in the quote; the routed board's design rule check (0 copper errors, every keep-out kept) and the maker's impedance coupon prove them (lesson: planes).
RV1126B memory; 1 camera MIPI link (100 Ω pairs); USB (90 Ω); antenna feed (50 Ω, keep-out on every layer); card lines (length-matched, no vias under the socket)ground on inner layer 1, supply on inner layer 2, no vias in pads, impedance lines routed firstto prove on the dev kit
MoistureConformal coating
The posts stand out in rain. Asked for in the quote (lesson: moisture).
coatedcoated, sensors, sockets and antennas maskedpasses
FitBoard inside the product CAD, every part checked in 3D
The folded board from the 3D model is placed in the product CAD and every part is checked against every wall and bought part that stays.
no part touches a wall or a bought part (2026-11-03)nothing touchespasses
CameraThe two posts agree on time
Both posts see the line; their clocks must agree to well inside 0.01 s. Measured on rev A.
clock shared over the post-to-post link≤ 1 msto prove on the dev kit

Before we order the first boards, we prove these on the RV1126B development kit or in the rev A tests:

  1. AI engine time per frame
  2. Ball-grid chips
  3. Card grade
  4. Wi-Fi between the two posts
  5. Fast lines on a solid ground plane
  6. The two posts agree on time

Where the design stands

  1. 1Shape and placementdone

    Board outline in the post's shape, all 71 parts placed at their real size (62 on the post board, 9 on the starter board), fit checks and KiCad design rule check (0 violations).

  2. 2Schematicnext

    Every wire between the chips, from the V1, C1 and S1 core circuits.

  3. 3Footprintsnext

    The exact solder pads under each chip.

  4. 4Routinglater

    Copper tracks on all layers, incl. the processor's memory lines and the NFC loop; reviewed by a Rockchip-experienced engineer.

  5. 5Files for the makerlater

    Gerbers with copper, drill, mask, paste, the rigid-flex drawing and the assembly parts list. These go to the board maker.

  6. 6Rev A boardsMar 2027

    Made, assembled and tested on our fixture, after CricketOne's V1 core is proven.

Design files (rev A-0)

These are the stage 1 files: the board's shape and where every part goes. A board maker needs the stage 5 files to build it.

Who can make it

Each post board is one rigid-flex piece about 1.6 m long unfolded: an 8-layer HDI brain with ball-grid chips and 4-layer sections, joined by flex. It needs a maker who builds rigid-flex boards and assembles ball-grid chips with X-ray checks. We plan three quotes once the stage 5 files are ready: two from China for price, and one from the US for speed.

MakerWhereRigid-flexHDI / layersAssemblyFit for us
PCBWayfirst quoteShenzhen, Chinayes, 6 to 16 layersHDI up to 32 layers, 0.35 mm BGA pitchyes, turnkey, incl. BGA and X-rayBest fit for rev A: the rigid-flex board and its assembly in one order
NextPCBsecond quoteShenzhen, ChinayesHDI, 6 to 32 layersyes (PCBA)Second quote, to compare price and lead time
ALLPCBChina (a network of partner factories)yes, through partner factories1 to 30 layersyesThird quote; check which factory builds it
JLCPCBShenzhen, Chinano (flex only: 1, 2 and 4 layers, up to 490 mm)HDI added Sep 2026yes, incl. BGANot for the one-piece board today. Good for the test fixture, simple boards, and the fallback of separate rigid boards joined by soldered flex
Sierra Circuits (ProtoExpress)US quoteSunnyvale, California, USAyesyesyes, in-house, incl. BGA; turnkey in about 5 daysUS option: fastest turn and engineering help, at a higher price
CirexxSanta Clara, California, USAyesyesyes (turnkey or consigned)Second US option
Advanced CircuitsAurora, Colorado, USAyescheckyesUS quick-turn; check its rigid-flex assembly
EpecNew Bedford, Massachusetts, USAyescheckyes; also builds battery packsUS option that can also make a certified LiFePO4 pack

From each maker's own capability pages, checked 3 November 2026. Limits change, so each quote confirms them for our exact stack-up.

Full design notes

All 71 parts, what is on each section, every connection, heat, power, the factory test, cost and timeline.