RoadOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-B1-RD-A

We are asking for a turnkey quote: finish the design of our signal-head board set, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from a 120 V feed through the power board, or a 5 V 4 A bench supply on lead L1, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/roadone-boards.

1. The board

Five boards and three tabs inside a 3-section 12 in vehicle signal head, behind the head’s own LED modules. One rigid-flex piece: an 8-layer 110 × 90 mm main board flat on the head floor (RK3576J with a heat block to an aluminium spreader, 4 GB LPDDR4X, 32 GB eMMC, latched microSD, RK806S power, MEMS clocks, security and ID chips, LSM6DSOX motion chip, eFuse, SMD buzzer, latched 6-pin lead header); a 4-layer 44 × 44 mm corner board on a 274 mm flex (approach camera tab, Hall tamper switch, supplies); a 4-layer 303 × 580 mm back strip on a 44 mm flex (radar tab, 16 call-light LEDs and two drivers, the BG95-M3 LTE-M module with a soldered eSIM and chip antenna, the AP6275S Wi-Fi/BT module); a 4-layer 100 × 84 mm side strip on a 131 mm flex (crossing camera tab and supplies); three 16 × 16 mm tabs on 40 mm flex hinges (two IMX415 with M12 lens holders, a TI IWRL6432AOP radar chip). A separate 2-layer 105 × 200 mm power board: spring-clamp supply terminal, fuse, varistor, Mean Well IRM-20-5, three PCB current transformers and an ADS131M04 ADC, three photo-MOS contacts with a 4-pole spring-clamp terminal, a soldered 18650 holder with a thermistor and charger, latched 6-pin header. Lead L1 made to length.

The outline, sections and placement of all 66 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Rockchip RK3576J (industrial), 8 cores, 6 TOPS NPU, 16 MP ISP; heat block down to the aluminium L-spreader on the head floor	main
HS1	Aluminium block 24 × 24 × 6.7 with 1 mm gap pads, from the RK3576J to a 3 mm aluminium L-spreader on the head floor; its upright is bolted through the back wall to the steel pole bracket	main
U2	LPDDR4X 32 Gbit ×32 (4 GB), 200-ball FBGA	main
U11	eMMC 5.1 32 GB industrial, 153-ball FBGA (shipped empty, so the card always starts first; our loader on the card reads the card first; keeps the counts and the call log)	main
BZ1	SMD magnetic buzzer 11 × 11 (CUI CMT-1102-SMT class) over the tone holes in the head floor: the tone for people waiting	main
C1	RK3576J decoupling field (behind the chip)	main
U3	Rockchip RK806S-5 power chip and inductors: RK3576J core, NPU, GPU, logic, DDR and 1.8/3.3 V from the 5 V rail	main
Y1	24 MHz MEMS oscillator (SiTime SiT8008 class)	main
Y2	32.768 kHz MEMS oscillator (SiTime SiT1533 class)	main
U8	Microchip ATECC608B security chip, UDFN-8: signs every call, count record and fault into the append-only log	main
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	main
J1	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; reached by opening the door	main
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	main
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	main
U13	ST LSM6DSOX 6-axis motion chip, LGA-14: the head hit by a vehicle or turned off its approach	main
J2	Molex Micro-Fit 3.0 43045-0612 6-pin vertical header, positive latch (5 V ×2, GND ×2, cell sense, contact drive) for lead L1	main
U42	TI TPS25947 class eFuse (3.5 A, reverse block) + TVS on the 5 V from the power board	main
TP1	Factory pads: USB 2.0, debug serial, boot, rails, current sense	main
U7	TI DRV5032FB Hall switch facing the door: a Ø6 × 3 magnet on a printed boss on the door holds it; opening the door is logged and signed	corner
U26	Approach camera LDOs 2.9 / 1.8 / 1.1 V and its 37.125 MHz MEMS oscillator	corner
U28	ESD and TVS array on the camera and tamper lines	corner
U21	Crossing camera LDOs 2.9 / 1.8 / 1.1 V and its 37.125 MHz MEMS oscillator	side
U25	ESD and TVS array on the camera lines	side
D11	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D12	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D13	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D14	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D15	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D16	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D17	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D18	White high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the “seen you” slot in the back wall	back
D21	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
D22	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
D23	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
D24	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
D25	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
D26	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
D27	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
D28	Red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind a printed light guide to the red confirmation slot in the back wall	back
U70	Constant-current LED driver for the seen-you light row (PWM dimmed for night)	back
U71	Constant-current LED driver for the red confirmation light row (PWM dimmed for night)	back
U24	IWRL6432 1.8 / 1.2 V supply and its 40 MHz MEMS oscillator	back
U27	ESD and TVS array on the radar and light lines	back
U5	AMPAK AP6275S Wi-Fi 6 + Bluetooth 5 module (certified, RK3576 SDK default): BLE for the contractor’s fit-up phone; antenna at its left edge, 100 mm from the pole	back
U6	Quectel BG95-M3 LTE-M / NB-IoT module, LGA (certified): calls, counts and faults to the traffic centre; no inbound ports	back
U6S	Soldered eSIM (MFF2), no card slot to knock loose	back
J10	WAGO 2604 class 3-pole spring-clamp PCB terminal for the unswitched 120 V feed (L, N, PE) on a spare conductor of the head’s own signal cable, fused in the cabinet; behind a printed shield	power
F10	1 A slow fuse, 275 V varistor and the class II creepage slot	power
PS1	Mean Well IRM-20-5 PCB-mount 5 V 4 A 20 W supply (class II, listed)	power
CT1	PCB-mount current transformer, 5 A, the head’s own red module feed wire passing through its window unbroken (Talema AC1005 class): which aspect the controller is showing and a dark module	power
CT2	PCB-mount current transformer, 5 A, the head’s own amber module feed wire passing through its window unbroken (Talema AC1005 class): which aspect the controller is showing and a dark module	power
CT3	PCB-mount current transformer, 5 A, the head’s own green module feed wire passing through its window unbroken (Talema AC1005 class): which aspect the controller is showing and a dark module	power
U51	TI ADS131M04 4-channel simultaneous-sampling ADC for the three feed sensors, on SPI	power
BT1	Keystone 1042 class 18650 holder, soldered, with one Samsung INR18650-35E cell: keeps the fault log and the LTE-M fault message going in a power cut	power
RT1	10 k NTC thermistor against the cell, read by the charger	power
U50	TI BQ25895 class charger with power-path: charges the cell at 1 A only between 0 and 45 °C	power
K1	Panasonic AQY212EH class photo-MOS contact, 5,000 V isolation, on the controller’s own walk demand detector input	power
K2	Panasonic AQY212EH class photo-MOS contact, 5,000 V isolation, on the controller’s own crossing extension detector input	power
K3	Panasonic AQY212EH class photo-MOS contact, 5,000 V isolation, on the controller’s own vehicle demand detector input	power
J11	WAGO 2604 class 4-pole spring-clamp PCB terminal for the three detector pairs and their common, on spare conductors back to the cabinet	power
J12	Molex Micro-Fit 3.0 43045-0612 6-pin vertical header, positive latch, for lead L1	power
U260	Sony IMX415-AAQR-C 8 MP colour camera chip (C1, 3840 × 2160), 25° down the approach through the door’s bottom road-side corner: demand, queue, counts, class, speed	tab
LH1	M12 lens holder with a 102 × 69.6° lens, its front 0.3 mm inside the wall at the closest corner, the lens barrel 9.1 mm on through the window to just inside the face	tab
U200	Sony IMX415-AAQR-C 8 MP colour camera chip (C1), 25° down to the stop line and the whole crossing: red light, people crossing, near misses, a blocked crossing	tab
LH2	M12 lens holder with a 102 × 69.6° lens, its front 0.3 mm inside the wall at the closest corner, the lens barrel 10.2 mm on through the window to just inside the face	tab
U250	TI IWRL6432AOP 60 GHz radar chip with its antennas on the package, 30° down behind the PC radome: people waiting at the kerb and stepping on to the crossing	tab

Each part’s size, side and position is in roadone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RK3576 reference design and our block list. We review it before layout.
2. Layout in our outline and placement: the RK3576 memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RK3576 SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: approach camera IMX415 at 3840 × 2160, 10 fps; crossing camera IMX415 at 3840 × 2160, 10 fps. We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J1, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Approach camera: IMX415 streams 3840 × 2160 at 10 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
5. Crossing camera: IMX415 streams 3840 × 2160 at 10 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
6. Radios: U6 (Quectel BG95-M3 LTE-M / NB-IoT module): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: BZ1 (SMD magnetic buzzer 11 × 11), U91 (microSD ESD and filter array), U7 (TI DRV5032FB Hall switch facing the door), D11–D18 (White high-brightness LED), D21–D28 (Red high-brightness LED), U27 (ESD and TVS array on the radar and light lines), U51 (TI ADS131M04 4-channel simultaneous-sampling ADC for the three feed sensors), U250 (TI IWRL6432AOP 60 GHz radar chip with its antennas on the package).
8. Power: the draw at idle and at full load from a 120 V feed through the power board, or a 5 V 4 A bench supply on lead L1, against our estimate.
9. Heat: the RK3576J temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	5 and 20: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 16 pass, 5 fixed by the review, 12 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Power cut
• RK3576J temperature, a summer afternoon (40 °C air) with sun on the dark polycarbonate head
• Card grade
• LTE-M from the signal head
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Controller contacts
• Supply kept on its own board
• Sensor tabs on their brackets
• Flexes and the lead
• Door tamper sensor

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]