RacketOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-RO-NP-A

We are asking for a turnkey quote: finish the design of our net-post board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from its battery, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/racketone-boards.

1. The board

One rigid-flex spine up each round net post (Ø76.2 tube), side A to the court face: a cell tab on the four cells, the foot section (charger, protection, gauge, boost, charge socket, tamper), the kitchen camera head, the lower section (lamp, tone, two key tabs), the panel section with the e-paper tail soldered, the brain (RV1126B under a heat block), the radio section behind one radio window (radar, ESP32-S3, Wi-Fi/BT, and on the home post LTE-M), and the upper section with the mic, motion sensor and the line camera head. Both posts carry the same board; the away post leaves the home-only parts unfitted.

The outline, sections and placement of all 62 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
BT1	Nickel-strip pad, cell pack + (4 × Samsung INR18650-35E in parallel)	celltab
BT2	Nickel-strip pad, cell pack − (strip up the pack side), with the pack thermistor	celltab
U30	TI BQ24074 1-cell Li-ion charger, 1.5 A, power path, VQFN-16	foot
U31	1-cell Li-ion protector (TI BQ2970 class) + dual FET	foot
U32	Battery gauge, coulomb counting (MAX17260 class)	foot
U33	Charge input: 20 V TVS, reverse protection, fuse	foot
U34	TI TPS61023 boost, cells to 5 V (lamp LEDs, sounder) + inductor	foot
U35	Load switch: the V1 core is on only in a match (S1 controls it)	foot
RS1	Current-sense resistor for the gauge, 2512	foot
TP2	Factory pads: cell voltage, charge current, gauge I2C	foot
J1	M8 3-pin A-coded female PCB socket, rear mount through the court face under a tethered cap (screw-locked charge lead)	foot
SW1	Omron D2F-01 tamper switch, pressed by a boss on the inside of the service hatch	foot
LH2	M8 × 0.35 lens holder with a 2.8 mm lens (about 69° × 46° on the OV9281, est.)	khead
U25	OmniVision OV9281 global-shutter camera chip, 1280 × 800 at 120 fps	khead
U26	Three camera LDOs (2.8 V analog, 1.8 V, 1.2 V)	khead
Y25	24 MHz MEMS oscillator for the camera (SiT8008 class, shock-rated)	khead
LS1	Magnetic sounder 12 × 12 SMD under the tone holes	lower
Q1	Sounder driver FET	lower
U46	Level shifter for the call-lamp LED data line	lower
SW2	Sealed tactile switch IP67 (C&K KSC class), pressed by the stainless plunger in the north key hole	ktabN
SW3	Sealed tactile switch IP67 (C&K KSC class), pressed by the stainless plunger in the south key hole	ktabS
J2	24 hot-bar pads for the 2.13 in e-paper panel’s own tail (no connector)	panel
U6	The panel maker’s booster circuit (inductor, FET, diodes, caps) for the panel’s on-glass driver	panel
TP4	Factory pads: panel supply and SPI	panel
U1	Rockchip RV1126B-P, FCCSP-409, 0.65 mm pitch; under the heat block	brain
HB1	Aluminium heat block 16 × 16 on a 0.5 mm pad on the RV1126B, its curved face on a 1 mm pad on the court-face wall	brain
U2	LPDDR4X 8 Gbit ×32 (1 GB), 200-ball FBGA	brain
U3	Multi-rail regulators for the RV1126B (core, NPU, logic, DDR, 1.8/3.3 V) + inductors	brain
U4	Buck-boost 2.7–4.2 V cells to 3.3 V (TPS63020 class) + inductor	brain
C1	RV1126B decoupling field (under the chip)	brain
U10	eMMC 5.1 8 GB industrial, 153-ball FBGA; shipped empty (the processor tries the eMMC before the card, so an image here would win): our loader on the card is set to read the card first	brain
J3	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card	brain
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	brain
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	brain
TP1	Factory pads: USB 2.0 (writing software), debug serial, boot, rails, current sense	brain
U8	Microchip ATECC608B security chip, UDFN-8	brain
U9	ID EEPROM 2 kbit	brain
Y1	24 MHz MEMS oscillator (SiTime SiT8008 class, rated to 50,000 g; a quartz crystal is not rated for the shock)	brain
Y2	32.768 kHz MEMS oscillator for the clock (SiTime SiT1533 class, shock-rated)	brain
U70	Infineon BGT60TR13C 60 GHz radar, antennas in package, VFWLB 6.5 × 5 × 0.9: court in use, no-shows, lights-off	radio
U71	Radar LDOs (1.8 / 3.3 V) and 80 MHz MEMS oscillator (SiTime SiT8008 class, shock-rated)	radio
U40	Espressif ESP32-S3-WROOM-1-N8R8 (certified): score, keys, e-paper, radar, lets, bookings, post-to-post link	radio
U5	AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module (certified): clips to the phone on CHALLENGE	radio
U11	Wi-Fi 37.4 MHz MEMS oscillator (SiTime SiT8008 class, shock-rated; the AP6256 runs from 37.4 MHz, not 26 MHz), 32 kHz from the processor and RF match	radio
U41	Quectel BG95-M3 LTE-M / NB-IoT modem, LCC: the court’s link (bookings, lights-off, the call log)	radio (home only)
U42	MFF2 eSIM, soldered (no SIM socket)	radio (home only)
TP3	Factory pads: ESP32-S3 USB, boot, enable	radio
MK1	Infineon IM69D130 digital MEMS mic, bottom port under the court-face port (PTFE membrane): noise, paddle pops	upper
U7	ST LSM6DSOX motion sensor, feels the cord through the post	upper
TP5	Factory pads: mic clock and data, motion sensor I2C	upper
LH1	M8 × 0.35 lens holder with a 2.2 mm lens (about 82° × 57° on the OV9281, est.)	lhead
U20	OmniVision OV9281 global-shutter camera chip, 1280 × 800 at 120 fps	lhead
U21	Three camera LDOs (2.8 V analog, 1.8 V, 1.2 V)	lhead
Y20	24 MHz MEMS oscillator for the camera (SiT8008 class, shock-rated)	lhead
D1	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower
D2	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower
D3	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower
D4	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower
D5	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower
D6	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower
D7	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower
D8	RGB LED with driver, 5050 (WS2812B class), behind the clear lamp strip	lower

Each part’s size, side and position is in racketone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RV1126B reference design and Espressif’s ESP32-S3 hardware design guide and our block list. We review it before layout.
2. Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Underfill under U1, U2, U10, U5, and flexible-termination capacitors near the board edges (the product takes shocks of about 1500 g). Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK, with a real-time (PREEMPT_RT) kernel and the cameras’ frame-sync inputs. A Rockchip SDK image must start from the microSD card. Camera drivers: line camera OV9281 at 1280 × 800, 120 fps; kitchen camera OV9281 at 1280 × 800, 120 fps. Flash our ESP32-S3 image (we send it). We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J3, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

Please quote both battery options:

• A: cells fitted. 4 × Samsung INR18650-35E soldered to the pack pads, protection checked, charged to storage level, and shipped as cells in equipment (UN3481). Please tell us your rules for this.
• B: cells not fitted. A short, polarised battery lead and plug on the pack pads, plus one charged pack per board. Nothing else to do on our side.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Line camera: OV9281 streams 1280 × 800 at 120 fps with no lost frames over 10 minutes, and a frame of a test chart is saved; the frame-sync input triggers frames.
5. Kitchen camera: OV9281 streams 1280 × 800 at 120 fps with no lost frames over 10 minutes, and a frame of a test chart is saved; the frame-sync input triggers frames.
6. Radios: U40 (Espressif ESP32-S3-WROOM-1-N8R8); U5 (AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module); U11 (Wi-Fi 37.4 MHz MEMS oscillator); U41 (Quectel BG95-M3 LTE-M / NB-IoT modem): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: SW1 (Omron D2F-01 tamper switch), LS1 (Magnetic sounder 12 × 12 SMD under the tone holes), SW2, SW3 (Sealed tactile switch IP67), U91 (microSD ESD and filter array), U70 (Infineon BGT60TR13C 60 GHz radar), MK1 (Infineon IM69D130 digital MEMS mic), U7 (ST LSM6DSOX motion sensor), D1–D8 (RGB LED with driver).
8. Battery: charges from the charge input at the set voltage; protection cuts off at low voltage and on a short; the gauge reads charge; the thermistor reads.
9. Power: the draw in each state of our day (match play about 2.6 W, no match about 0.25 W), so we can check our design review: at least 10 hours, cells aged and cold.
10. Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	2 and 6: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 20 pass, 6 fixed by the review, 6 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Ball-grid chips
• Card grade
• Link between the two posts
• Fast lines on a solid ground plane
• Radar with a MEMS reference clock

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]