PumpOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-W1-PN-A

We are asking for a turnkey quote: finish the design of our pump-panel board set, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from the panel’s 120 V control circuit through the power board, or a 5 V 4 A bench supply on lead L1, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/pumpone-boards.

1. The board

Three boards and two tabs inside a 24 × 20 × 8 in NEMA 4X duplex pump control panel. An 8-layer 170 × 225 mm main board on stand-offs inside the right side wall (RV1126B with a heat block to the wall, 2 GB LPDDR4X, 16 GB eMMC, latched microSD, MEMS clocks, security and ID chips, eFuse, AP6256 Wi-Fi/BT, BG95-M3 LTE-M with a soldered eSIM, coax pads for the puck antenna, latched 10- and 14-pin lead headers) with two 16 × 16 mm tabs on 40 mm flex hinges (IMX415 with an M12 lens holder, TI IWRL6432AOP radar chip). A 4-layer 170 × 275 mm power board on the same wall: spring-clamp terminals for the 120 V control circuit, the two current clamps, the level loop and float, the pump run calls and the alarm contact; fuse, varistor, Mean Well IRM-20-5, a soldered 18650 holder with a thermistor and charger, TI ADS131M04 ADC, TI AMC1311 isolated amplifier, three optocouplers, an Omron G5V-1 relay. A 2-layer 290 × 318 mm door board: 2.13 in e-paper panel (FPC hot-bar soldered), 8 WS2812B-2020 LEDs, SMD piezo, MLX90640 heat chip, TMAG5273 Hall chip. Leads L1 and L2 made to length; L2 in high-flex wire for the hinge loop.

The outline, sections and placement of all 65 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Rockchip RV1126B, FCCSP-409, 0.65 mm pitch, side A to the wall under a heat block to the stainless side wall	main
HS1	Aluminium block 20 × 20 with 1 mm gap pads, from the RV1126B to the stainless right side wall (shaded by the station’s sun shield)	main
U2	LPDDR4X 16 Gbit ×32 (2 GB), 200-ball FBGA	main
U11	eMMC 5.1 16 GB industrial, 153-ball FBGA (shipped empty, so the card always starts first; our loader on the card reads the card first; keeps the station log and the call log)	main
C1	RV1126B decoupling field (behind the chip, side B)	main
U3	Power: rails for the RV1126B (core, NPU, logic, DDR, 1.8/3.3 V) from the 5 V rail	main
Y1	24 MHz MEMS oscillator (SiTime SiT8008 class)	main
Y2	32.768 kHz MEMS oscillator (SiTime SiT1533 class)	main
U8	Microchip ATECC608B security chip, UDFN-8: signs every station call, pump run and entry into the append-only log	main
U9	ID EEPROM 2 kbit (product, board version, serial, calibration of the level and current inputs)	main
J1	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; reached by opening the door	main
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	main
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	main
U5	AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module (certified, RV1126B SDK default): BLE pairing for the operator’s phone at the station; its antenna is the 2.4 GHz element of the puck through the top wall	main
Y3	37.4 MHz MEMS oscillator for the AP6256 Wi-Fi/BT module (SiTime SiT8008 class, shock-rated)	main
U6	Quectel BG95-M3 LTE-M / NB-IoT module, LGA (certified): calls, readings and callouts to the on-call operator; no inbound ports	main
U6S	Soldered eSIM (MFF2), no card slot to knock loose	main
PD2	Solder pads for the two RG-178 coax leads of the 2-in-1 puck antenna through the top wall (LTE-M and 2.4 GHz), strain-relief slot beside them; no snap-on coax connector to shake loose	main
J2	Molex Micro-Fit 3.0 43045-1012 10-pin vertical header, positive latch (5 V ×2, GND ×3, cell sense, ADC SPI ×4) for lead L1	main
J5	Molex Micro-Fit 3.0 43045-1412 14-pin vertical header, positive latch (5 V, GND ×3, I²C, e-paper SPI and busy/reset, LED data, piezo) for lead L2 across the hinge loop	main
U42	TI TPS25947 class eFuse (3.5 A, reverse block) + TVS on the 5 V from the power board	main
U21	Station camera LDOs 2.9 / 1.8 / 1.1 V and its 37.125 MHz MEMS oscillator	main
U24	IWRL6432 1.8 / 1.2 V supply and its 40 MHz MEMS oscillator	main
U25	ESD and TVS array on the camera and radar lines	main
TP1	Factory pads: USB 2.0, debug serial, boot, rails, current sense	main
J10	WAGO 2604 class 3-pole spring-clamp PCB terminal for the panel’s 120 V control circuit (L, N, PE), 7.5 mm pitch, behind a printed shield	power
F10	1 A slow fuse, 150 V varistor and the class II creepage slot	power
PS1	Mean Well IRM-20-5 PCB-mount 5 V 4 A 20 W supply (class II, listed)	power
J12	Molex Micro-Fit 3.0 43045-1012 10-pin vertical header, positive latch, for lead L1	power
BT1	Keystone 1042 class 18650 holder, soldered, with one Samsung INR18650-35E cell: keeps the power-lost call and the LTE-M callout going when the station loses power	power
RT1	10 k NTC thermistor against the cell, read by the charger	power
U50	TI BQ25895 class charger with power-path: charges the cell at 1 A only between 0 and 45 °C	power
U51	TI ADS131M04 4-channel 24-bit simultaneous-sampling ADC: both pump currents, the level loop and the float, at 4 kHz	power
U53	TI AMC1311 isolated amplifier across a 100 Ω precision shunt in the station’s 4–20 mA level loop (the loop stays the level controller’s)	power
U54	Vishay H11AA1 class AC-input optocoupler on the pump 1 call-to-run (120 V)	power
U55	Vishay H11AA1 class AC-input optocoupler on the pump 2 call-to-run (120 V)	power
U56	Optocoupler on the high float contact (wetted by our isolated 12 V)	power
U57	Burden resistors and anti-alias filters for the two current clamps	power
U58	TVS array on every station input (surges on the pump leads)	power
K1	Omron G5V-1 relay: a dry contact to the panel’s own alarm light and any existing autodialer or SCADA input	power
J13	WAGO 2604 class 4-pole spring-clamp terminal for the two current clamps’ leads	power
J14	WAGO 2604 class 4-pole spring-clamp terminal: 4–20 mA loop in and out, float pair	power
J15	WAGO 2604 class 3-pole spring-clamp terminal: pump 1 call, pump 2 call, neutral (120 V), behind the printed shield	power
J16	WAGO 2604 class 2-pole spring-clamp terminal for the alarm relay contact	power
EPD1	Good Display GDEY0213B74 2.13 in e-paper panel (250 × 122), its face in the door window: level, pumps, power and the last call	door
D1	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
D2	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
D3	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
D4	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
D5	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
D6	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
D7	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
D8	WS2812B-2020 RGB LED behind the door’s call-light slot: red, amber, white flash for the calls	door
BZ1	SMD piezo transducer 12 × 12 × 3 (PUI AT-1220 class) behind the tone holes	door
U240	Melexis MLX90640ESF-BAA 32 × 24 heat chip, 110° × 75° lens in its TO39 can, side B looking straight back at both pump breakers, contactors and overloads and the terminal strip	door
U23	3.3 V LDO for the MLX90640	door
U7	TI TMAG5273 3D Hall chip at the board’s top edge, under a Ø10 × 5 magnet on a printed boss on the body’s top wall: opening the door is logged and signed	door
U61	E-paper booster (inductor, MOSFET, diodes) and its 24-pin FPC solder pads (the panel’s tail is hot-bar soldered, no connector)	door
U62	74LVC1T45 level shifter for the call-light data line	door
U63	Piezo driver transistor and resistor	door
J20	Molex Micro-Fit 3.0 43045-1412 14-pin vertical header, positive latch, for lead L2	door
U64	ESD array on the lead L2 lines	door
U200	Sony IMX415-AAQR-C 8 MP colour camera chip (C1, 3840 × 2160), 15° down through the right side window: the wet-well hatch, both riser gauges and the gate	tab
LH1	M12 lens holder with a 102 × 67° lens, its front 0.3 mm inside the wall at the closest corner, the lens barrel 2 mm on through the window to just inside the face	tab
U250	TI IWRL6432AOP 60 GHz radar chip with its antennas on the package, 10° down behind the PC window: a person at the hatch or the riser in the dark	tab

Each part’s size, side and position is in pumpone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RV1126B reference design and our block list. We review it before layout.
2. Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: station camera IMX415 at 3840 × 2160, 5 fps; station camera IMX415 at 3840 × 2160, 5 fps. We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J1, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Station camera: IMX415 streams 3840 × 2160 at 5 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
5. Station camera: IMX415 streams 3840 × 2160 at 5 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
6. Panel heat camera: reads a full 32 × 24 frame of a warm target.
7. Radios: U5 (AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module); U6 (Quectel BG95-M3 LTE-M / NB-IoT module): each joins or answers a test station.
8. Sensors and outputs, each read or driven in turn: U91 (microSD ESD and filter array), U25 (ESD and TVS array on the camera and radar lines), K1 (Omron G5V-1 relay), D1–D8 (WS2812B-2020 RGB LED behind the door’s call-light slot), U7 (TI TMAG5273 3D Hall chip at the board’s top edge), U250 (TI IWRL6432AOP 60 GHz radar chip with its antennas on the package).
9. Power: the draw at idle and at full load from the panel’s 120 V control circuit through the power board, or a 5 V 4 A bench supply on lead L1, against our estimate.
10. Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	5 and 20: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 18 pass, 5 fixed by the review, 10 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Power cut
• Card grade
• LTE-M from inside the stainless panel
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Sensor tabs on their brackets
• Control circuit kept on the power board
• Door tamper sensor
• Leads and the antenna coax

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]