PoolOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-PO-PB-A

We are asking for a turnkey quote: finish the design of our latch-post board and hinge-post board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from a 12 V bench supply, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/poolone-boards.

1. The board

Two rigid-flex boards, each standing up the inside of a 50 × 50 × 2 aluminium gate post (46 × 46 bore). Latch-post board: an 8-layer 44 × 835 spine with the RV1126B on side B under a heat block to the post wall, 2 GB LPDDR4X, 32 GB eMMC, MEMS clocks, AP6256 Wi-Fi/BT, security and ID chips, TMAG5273 3D Hall chip, THVD1450 RS-485 link, 12 V buck, BQ24074 charger, two soldered 18650 holders with a thermistor, latched link lead, 16 call-light LEDs (8 on each face), sounder; a 20 × 20 pool head with the Sony IMX415 and an M12 lens holder, tilted 20° down; a 14 × 42 radar head with the TI IWRL6432AOP and a chip antenna; a 40 × 30 top tab with the tamper switch and the latched microSD. Hinge-post board: a 4-layer 44 × 480 spine with the ESP32-S3-WROOM-1 module, security and ID chips, THVD1450 link, 12 V input and buck, BQ24074 charger, one soldered 18650 holder with a thermistor, latched supply and link leads; a 16 × 16 outside head with the OV2640 and an M7 lens holder, tilted 35° down; a 40 × 30 top tab with the tamper switch and the latched microSD.

The outline, sections and placement of all 64 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Rockchip RV1126B, 3 TOPS NPU, ISP, MIPI CSI-2 (the IMX415), on side B under a heat block to the outside wall	lspine
HB1	Copper heat block 16 × 16 × 9.4 with a 1 mm gap pad from U1 to the post’s outside wall: the aluminium post is the heat sink	lspine
U10	LPDDR4X 2 GB (clips of unsure calls, the two camera pipelines)	lspine
U5	eMMC 32 GB (shipped empty, so the card always starts first; our loader on the card reads the card first; keeps the call log)	lspine
U3	Rockchip RK806 class PMIC for the RV1126B rails	lspine
Y1	MEMS oscillator 24 MHz (SiTime SiT8008 class)	lspine
U2	Microchip ATECC608B, UDFN-8: signs every call, keeps the append-only log key	lspine
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	lspine
U11	TI TMAG5273 3D Hall sensor, SOT-23-6, at the gate-face edge: the leaf magnet’s field in three axes (latched, bounced, ajar, propped, and a second magnet held to the post)	lspine
LS1	Magnetic sounder 12 × 12 SMD under the outside tone holes (the call tone), with a printed sound tube to the wall	lspine
GK1	Printed sound tube from the sounder to the tone holes, with a mesh	lspine
LP2	Printed clear light guide from the 8 outside LEDs to the outside opal slot	lspine
U7	Level shifter for both call-light data lines (3.3 to 5 V)	lspine
TP1	Factory pads: USB (RV1126B), serial console, boot, reset, rails, current sense	lspine
U6	AMPAK AP6256 Wi-Fi 5 + BT 5 module (the app through the home router; setup over BLE); its antenna on the radar head	lspine
Y2	MEMS oscillator 37.4 MHz for the Wi-Fi/BT module (SiTime SiT8008 class)	lspine
U14	TI THVD1450 RS-485 transceiver, 50 Mbps: the hinge post’s frames and status over the link lead	lspine
U4	12 V input with TVS, fuse and reverse block; TI TPS62933 12-to-5 V buck; TI BQ24074 1.5 A charger with power path (NTC input); TI TPS63020 3.3 V buck-boost	lspine
BT1	Keystone 1042 SMT holder for one 18650 cell (Samsung INR18650-35E), standing up the post, upper	lspine
BT2	Keystone 1042 SMT holder, 18650, lower	lspine
RT1	NTC thermistor 10 k, 0603, between the cells, read by the charger so charging holds outside 0–45 °C	lspine
J1	Molex Micro-Fit 3.0 vertical header, 4 circuits, latched: 12 V, ground and the RS-485 pair from the hinge post, up from the conduit under the gate	lspine
U12	Sony IMX415 8 MP camera chip, 3840 × 2160, 4-lane MIPI to the RV1126B: the deck, the water and the gate area	phead
L1	M12 holder and a 2.1 mm lens, about 110° × 77°, its front just inside the pool-face window	phead
U8	TI IWRL6432AOP 60 GHz radar, antennas in the package: who is in the pool area, adult or child by height, still or moving, and someone over the fence	rhead
U13	QSPI flash and the radar’s 40 MHz MEMS oscillator	rhead
AE1	Dual-band Wi-Fi/BT chip antenna behind the radome slot (the post is aluminium; the radome and the camera window are its only radio windows), fed over the head’s flex	lspine
SW1	Omron D2F-01, plunger up, pressed 0.5 mm by the cap when it is screwed down	ltab
J2	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; reached by lifting the cap	ltab
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	ltab
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	ltab
U21	Espressif ESP32-S3-WROOM-1-N16R8: runs the outside camera and sends JPEG frames over the link; its radio only for setup, antenna end up under the outside window	hspine
U22	Microchip ATECC608B: signs the hinge post’s frames and status	hspine
U29	ID EEPROM 2 kbit	hspine
U25	TI THVD1450 RS-485 transceiver: JPEG frames to the latch post at 2 fps	hspine
U24	12 V input from the buried lead with TVS, fuse and reverse block; TI TPS62933 12-to-5 V buck; TI BQ24074 1 A charger (NTC input); TI TPS63020 3.3 V buck-boost	hspine
TP21	Factory pads: USB (ESP32-S3 native), boot, enable, rails	hspine
BT21	Keystone 1042 SMT holder, 18650 (Samsung INR18650-35E), standing up the post	hspine
RT21	NTC thermistor 10 k, 0603, beside the cell	hspine
J21	Molex Micro-Fit 3.0 vertical header, 2 circuits, latched: 12 V from the listed plug-in supply on the pump pad’s GFCI outlet, through the gland at 120 mm	hspine
J22	Molex Micro-Fit 3.0 vertical header, 4 circuits, latched: 12 V and the RS-485 pair to the latch post, down the post and through the conduit under the gate	hspine
U23	OmniVision OV2640 2 MP camera chip, UXGA 1600 × 1200 at 15 fps over its 8-bit port to the ESP32-S3 (JPEG in the chip)	ohead
L3	M7 holder and a wide lens, about 100° across (rows cropped to 1600 × 720: 56° up and down), its front just inside the outside window	ohead
SW21	Omron D2F-01, pressed 0.5 mm by the hinge-post cap	htab
J23	microSD socket with a hinged, latched lid (Amphenol 101-00660 class): our software starts from the card	htab
U93	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	htab
U92	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	htab
D1	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D11	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
D2	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D12	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
D3	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D13	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
D4	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D14	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
D5	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D15	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
D6	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D16	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
D7	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D17	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
D8	RGB LED with driver, 5050 (WS2812B class), under the pool-face light guide	lspine
D18	RGB LED with driver, 5050 (WS2812B class), under the outside light guide	lspine
LP1	Printed clear light guide from the 8 pool LEDs to the pool-face opal slot	lspine

Each part’s size, side and position is in poolone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RV1126B reference design and Espressif’s ESP32-S3 hardware design guide and our block list. We review it before layout.
2. Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: pool camera IMX415 at 3840 × 2160, 5 fps; outside camera (hinge post) OV2640 at 1600 × 720, 2 fps. Flash our ESP32-S3 image (we send it). We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J2, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Pool camera: IMX415 streams 3840 × 2160 at 5 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
5. Outside camera (hinge post): OV2640 streams 1600 × 720 at 2 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
6. Radios: U6 (AMPAK AP6256 Wi-Fi 5 + BT 5 module); U21 (Espressif ESP32-S3-WROOM-1-N16R8): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: U11 (TI TMAG5273 3D Hall sensor), LS1 (Magnetic sounder 12 × 12 SMD under the outside tone holes), U8 (TI IWRL6432AOP 60 GHz radar), U13 (QSPI flash and the radar’s 40 MHz MEMS oscillator), U91, U93 (microSD ESD and filter array), D1–D18 (RGB LED with driver).
8. Power: the draw at idle and at full load from a 12 V bench supply, against our estimate.
9. Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	2 and 2: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 19 pass, 3 fixed by the review, 9 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Power cut
• Cell temperature, full sun, 40 °C air, black post
• Card grade
• Wi-Fi and BLE from the latch post
• Hinge post radio
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Hall chip to the leaf magnet

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]