KitchenOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-K1-HD-A

We are asking for a turnkey quote: finish the design of our hood board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from a 5 V bench supply, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/kitchenone-boards.

1. The board

One rigid-flex board in a range hood’s front compartment: a 4-layer 452 × 63.6 mm main strip flat on the compartment floor (hob side: MLX90640 heat-camera can, sounder, mic gasket; top side: ESP32-S3 module, security chip, latched microSD, latched leads to the 5 V supply and the hood fan, charger and two soldered 18650 holders with a thermistor), and a 60 mm wide 2-layer flex bending a 430 × 56 mm 2-layer front strip 90° up (room side: BGT60TR13C radar, 16 call-light LEDs, tamper switch, touch-strip electrodes).

The outline, sections and placement of all 39 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Espressif ESP32-S3-WROOM-1-N8R8: ESP32-S3, 8 MB flash, 8 MB PSRAM, PCB antenna, FCC/CE certified; castellated, soldered	main
U2	Microchip ATECC608B, UDFN-8: signs every call	main
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	main
J1	Molex Micro-Fit 3.0 single-row vertical header, 4 circuits, latched: 5 V and ground from the LRS-50-5, switched lamp out and ground	main
J3	Molex Micro-Fit 3.0 single-row vertical header, 4 circuits, latched: fan PWM, tach, ground, spare	main
U5	Fan PWM output (open drain, 25 kHz), tach input with filter, and a logic-level MOSFET switching the hood lamps	main
U4	5 V input: polyfuse, TVS, reverse block; TI BQ24074 1S charger with power path (1.5 A, NTC input); TI TPS63020 3.3 V buck-boost	main
BT1	Keystone 1042 SMT holder for one 18650 cell (Samsung INR18650-35E), back cell	main
BT2	Keystone 1042 SMT holder for one 18650 cell (Samsung INR18650-35E), front cell	main
RT1	NTC thermistor 10 k, 0603, between the two cell holders, read by the BQ24074 so charging holds outside 0–45 °C	main
J2	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card (ESP32-S3 SD bus; the loader the maker flashes reads our program from it)	main
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	main
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	main
MK1	Infineon IM69D130 MEMS mic, bottom port over a Ø1 hole through the board (whistles, the home’s own smoke and gas alarms)	main
U20	Melexis MLX90640ESF-BAA 32 × 24 thermal sensor, 110 × 75° lens, TO39 can, looking straight down at the hob through the Ø14 window	main
GK1	Silicone sound gasket Ø5 × 8 from the board hole to the mic port	main
LS1	Magnetic sounder 12 × 12 SMD over the tone holes	main
Q1	Sounder driver FET	main
TP1	Factory pads: USB (ESP32-S3 native), serial, boot, enable, rails, current sense	main
U3	Infineon BGT60TR13C 60 GHz radar, antennas in package (1 TX, 3 RX): someone at the hob or in the kitchen, a child near it	front
SW1	Omron D2F-01, plunger to the front, pressed through the Ø4 hole by the bolted fascia’s boss	front
E1	Copper touch electrodes (4 pads: lamp, fan, silence, call) read by the ESP32-S3 touch pins through the fascia	front
U7	Level shifter for the LED data line (3.3 to 5 V)	front
D1	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D2	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D3	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D4	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D5	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D6	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D7	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D8	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D9	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D10	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D11	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D12	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D13	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D14	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D15	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front
D16	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	front

Each part’s size, side and position is in kitchenone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Espressif’s ESP32-S3 hardware design guide and our block list. We review it before layout.
2. Layout in our outline and placement, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Firmware: flash our small ESP32-S3 loader (we send it). At each start it reads our program from the microSD card, so a new card is a software update.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J2, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts our loader and a test program from the microSD card.
4. Hob heat camera: reads a full 32 × 24 frame of a warm target.
5. Hob heat camera: reads a full 32 × 24 frame of a warm target.
6. Radios: U1 (Espressif ESP32-S3-WROOM-1-N8R8): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: U91 (microSD ESD and filter array), MK1 (Infineon IM69D130 MEMS mic), U20 (Melexis MLX90640ESF-BAA 32 × 24 thermal sensor), LS1 (Magnetic sounder 12 × 12 SMD over the tone holes), U3 (Infineon BGT60TR13C 60 GHz radar), D1–D16 (RGB LED with driver).
8. Power: the draw at idle and at full load from a 5 V bench supply, against our estimate.
9. Heat: the ESP32-S3 temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	5 and 20: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 9 pass, 2 fixed by the review, 7 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• Power cut
• Card grade
• Wi-Fi from inside a steel hood
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Cells charging in a hot hood
• Tamper switch against the fascia boss

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]