GarageOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-W1-GA-A

We are asking for a turnkey quote: finish the design of our opener-head board set, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from the opener’s mains through the power board, or a 5 V 2 A bench supply on lead L1, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/garageone-boards.

1. The board

Two rigid-flex pieces inside a 300 × 460 × 180 mm garage door opener head. Piece 1: an 8-layer 280 × 164 mm main board standing behind the door-end wall (RV1126B with a finned heat sink, 2 GB LPDDR4X, 16 GB eMMC, latched microSD, MEMS clocks, security and ID chips, eFuse, AP6256 Wi-Fi/BT with a chip antenna, SMD piezo, latched 10-pin lead header) with a 16 × 16 mm tab on a 40 mm flex hinge (IMX415 with an M12 lens holder) and two 2-layer 110 × 155 mm light strips on short flex folds (8 WS2812B-2020 LEDs each; a TMAG5273 Hall chip on the right strip). Piece 2: a 4-layer 280 × 164 mm power board in front of the back-end wall (spring-clamp terminals for the opener’s mains and the opener link, fuse, varistor, Mean Well IRM-10-5, a soldered 18650 holder with a thermistor and charger, photo-MOS relay, optocoupler, ADS1115 ADC and TCA9534 I/O expander, SHT45 on a slotted island, ICS-43434 bottom-port mic over a board hole) with a 16 × 16 mm tab on a 40 mm flex hinge (MLX90640). Lead L1 made to length.

The outline, sections and placement of all 60 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Rockchip RV1126B, FCCSP-409, 0.65 mm pitch, side A under a finned aluminium heat sink into the door bay	main
HS1	Finned aluminium heat sink 25 × 25 × 12 with a gap pad on the RV1126B, its fins in the door bay’s air, 6 mm clear of the wall	main
U2	LPDDR4X 16 Gbit ×32 (2 GB), 200-ball FBGA	main
U11	eMMC 5.1 16 GB industrial, 153-ball FBGA (shipped empty, so the card always starts first; our loader on the card reads the card first; keeps the call and door log)	main
BZ1	SMD piezo transducer 12 × 12 × 3 (PUI AT-1220 class) behind the tone holes, sealed to them by a Ø16 foam ring: the call tones and the UL 325 close warning	main
C1	RV1126B decoupling field (behind the chip, side B)	main
U3	Power: rails for the RV1126B (core, NPU, logic, DDR, 1.8/3.3 V) from the 5 V rail	main
Y1	24 MHz MEMS oscillator (SiTime SiT8008 class)	main
Y2	32.768 kHz MEMS oscillator (SiTime SiT1533 class)	main
U8	Microchip ATECC608B security chip, UDFN-8: signs every garage call and every door move it asks for, into the append-only log	main
U9	ID EEPROM 2 kbit (product, board version, serial, the camera’s aim at fitting)	main
J1	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; reached by taking off the cover	main
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	main
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	main
U5	AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module (certified, RV1126B SDK default): the home Wi-Fi and BLE pairing for the family’s phones	main
Y3	37.4 MHz MEMS oscillator for the AP6256 Wi-Fi/BT module (SiTime SiT8008 class, shock-rated)	main
ANT1	2.4/5 GHz chip antenna at the board’s top left corner with its keep-out, the corner farthest from the opener’s steel motor frame	main
J2	Molex Micro-Fit 3.0 43045-1012 10-pin vertical header, positive latch (5 V ×2, GND ×3, I²C ×2, I²S ×3) for lead L1	main
U42	TI TPS25947 class eFuse (3.5 A, reverse block) + TVS on the 5 V from the power board	main
U21	Door camera LDOs 2.9 / 1.8 / 1.1 V and its 37.125 MHz MEMS oscillator	main
U25	ESD array on the camera lines	main
U62	74LVC1T45 level shifter for the call-light data line out to both strips	main
U63	Piezo driver transistor and resistor	main
TP1	Factory pads: USB 2.0, debug serial, boot, rails, current sense	main
DL1	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DL2	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DL3	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DL4	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DL5	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DL6	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DL7	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DL8	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	left
DR1	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
DR2	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
DR3	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
DR4	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
DR5	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
DR6	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
DR7	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
DR8	WS2812B-2020 RGB LED behind the side call-light slot: green, amber, red and the white flash of the close warning	right
U7	TI TMAG5273 3D Hall chip at the strip’s top edge, under a Ø8 × 3 magnet in a boss under the cover: taking off the cover is logged and signed	right
U31	Sensirion SHT45 temperature and humidity chip behind the back-wall vents, on an island cut free by a slot so the supply’s warmth does not reach it	power
U32	TI/InvenSense ICS-43434 bottom-port I²S MEMS mic over a board hole, its port to side A and a foam gasket to the back-wall vents: the home’s smoke and CO alarm patterns and an engine left running	power
J10	WAGO 2604 class 3-pole spring-clamp PCB terminal for the opener’s own 120 V mains tap (L, N, PE), 7.5 mm pitch, behind a printed shield	power
F10	1 A slow fuse, 150 V varistor and the class II creepage slot	power
PS1	Mean Well IRM-10-5 PCB-mount 5 V 2 A 10 W supply (class II, listed), the same part as the bench head	power
J11	WAGO 2604 class 5-pole spring-clamp terminal for lead L2 to the opener’s own logic board: wall-button pair, door-position output, backup-battery plus and common	power
U70	Panasonic AQY212 class photo-MOS relay across the opener’s wall-button pair: a momentary press, isolated, exactly like the wall control’s own button	power
U71	Optocoupler on the opener board’s door-position output	power
U72	TI ADS1115 ADC (the opener’s backup-battery voltage through a divider) and a TCA9534 I/O expander (relay drive, position input), on the I²C of lead L1	power
U73	TVS array on every opener line	power
BT1	Keystone 1042 class 18650 holder, soldered, with one Samsung INR18650-35E cell: keeps the watching and the alerts going in a power cut	power
RT1	10 k NTC thermistor against the cell, read by the charger	power
U50	TI BQ25895 class charger with power-path: charges the cell at 0.5 A only between 0 and 45 °C	power
U23	3.3 V LDO for the MLX90640	power
J12	Molex Micro-Fit 3.0 43045-1012 10-pin vertical header, positive latch, for lead L1	power
TP2	Factory pads: rails, charger, I²C, relay test	power
U200	Sony IMX415-AAQR-C 8 MP colour camera chip (C1, 3840 × 2160), 25° down through the door-end window: the door, the doorway, both bays and the driveway when open	tab
LH1	M12 lens holder with a 102 × 67° lens, its front 0.3 mm inside the wall at the closest corner, the lens barrel 3.6 mm on through the window to just inside the face	tab
U240	Melexis MLX90640ESF-BAA 32 × 24 heat chip, 110° × 75° lens in its TO39 can, 40° down through the HDPE back window: the water heater’s pan and the back of the bay	tab

Each part’s size, side and position is in garageone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RV1126B reference design and our block list. We review it before layout.
2. Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: door camera IMX415 at 3840 × 2160, 5 fps; door camera IMX415 at 3840 × 2160, 5 fps. We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J1, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Door camera: IMX415 streams 3840 × 2160 at 5 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
5. Door camera: IMX415 streams 3840 × 2160 at 5 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
6. Heat camera: reads a full 32 × 24 frame of a warm target.
7. Radios: U5 (AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module): each joins or answers a test station.
8. Sensors and outputs, each read or driven in turn: BZ1 (SMD piezo transducer 12 × 12 × 3), U91 (microSD ESD and filter array), U7 (TI TMAG5273 3D Hall chip at the strip’s top edge), U31 (Sensirion SHT45 temperature and humidity chip behind the back-wall vents), U70 (Panasonic AQY212 class photo-MOS relay across the opener’s wall-button pair), U72 (TI ADS1115 ADC).
9. Power: the draw at idle and at full load from the opener’s mains through the power board, or a 5 V 2 A bench supply on lead L1, against our estimate.
10. Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	5 and 20: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 18 pass, 4 fixed by the review, 11 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Power cut
• Temperature chip away from the supply
• Card grade
• Home Wi-Fi and BLE from inside the opener head
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Sensor tabs on their brackets
• Mains kept on the power board
• Cover tamper sensor
• Leads

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]