DampOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-D1-FG-A

We are asking for a turnkey quote: finish the design of our fan-grille board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from a 5 V bench supply, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/dampone-boards.

1. The board

One 4-layer square ring board, 194 × 194 mm with a 118 mm opening, flat in the sealed rim of the fan grille: room side (floor heat camera, radar, call LEDs, sounder), ceiling side (ESP32-S3 module, security chip, tamper, mic, the latched lead from the housing, microSD, humidity chip on a slotted tongue at the vents), and the wall heat camera on a tab folded 60° up on a 4 mm flex.

The outline, sections and placement of all 36 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Espressif ESP32-S3-WROOM-1-N8R8: ESP32-S3, 8 MB flash, 8 MB PSRAM, PCB antenna, FCC/CE certified; castellated, soldered	ring
U2	Microchip ATECC608B, UDFN-8: signs every call	ring
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	ring
J1	Molex Micro-Fit 3.0 single-row vertical header, 4 circuits, latched (5 V, ground, fan PWM, fan tach), lead down from the housing through a grommet in the fascia top	ring
U4	5 V input: polyfuse, TVS, reverse block, TI TPS62A02 3.3 V buck	ring
U5	Fan PWM output (open drain, 25 kHz) and tach input with filter	ring
TP1	Factory pads: USB (ESP32-S3 native), serial, boot, enable, rails, current sense	ring
J2	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card (ESP32-S3 SD bus; the loader the maker flashes reads our program from it)	ring
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	ring
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	ring
SW1	Omron D2F-01, pressed through the Ø4 hole in the top by a printed plunger on the ceiling side	ring
U10	Sensirion SHT45 humidity and temperature, DFN 1.5 × 1.5, on the slotted tongue at the side vents	ring
MK1	Infineon IM69D130 MEMS mic, bottom port over a Ø1 hole through the board (running water, drips, the washer)	ring
U20	Melexis MLX90640ESF-BAA 32 × 24 thermal sensor, 110 × 75° lens, TO39 can, looking straight down through the floor window	ring
U21	Melexis MLX90640ESF-BAA 32 × 24 thermal sensor, 110 × 75° lens, TO39 can, on the folded tab facing the outside wall	tab
U3	Infineon BGT60TR13C 60 GHz radar, antennas in package (1 TX, 3 RX): someone in the room, even still in the bath	ring
GK1	Silicone sound gasket Ø5 × 8 from the board hole to the mic port	ring
LS1	Magnetic sounder 12 × 12 SMD under the tone holes	ring
Q1	Sounder driver FET	ring
U7	Level shifter for the LED data line (3.3 to 5 V)	ring
D1	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D2	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D3	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D4	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D5	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D6	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D7	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D8	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D9	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D10	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D11	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D12	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D13	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D14	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D15	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring
D16	RGB LED with driver, 5050 (WS2812B class), behind the opal slot	ring

Each part’s size, side and position is in dampone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Espressif’s ESP32-S3 hardware design guide and our block list. We review it before layout.
2. Layout in our outline and placement, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Firmware: flash our small ESP32-S3 loader (we send it). At each start it reads our program from the microSD card, so a new card is a software update.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J2, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts our loader and a test program from the microSD card.
4. Floor heat camera: reads a full 32 × 24 frame of a warm target.
5. Wall heat camera: reads a full 32 × 24 frame of a warm target.
6. Radios: U1 (Espressif ESP32-S3-WROOM-1-N8R8): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: U91 (microSD ESD and filter array), U10 (Sensirion SHT45 humidity and temperature), MK1 (Infineon IM69D130 MEMS mic), U20, U21 (Melexis MLX90640ESF-BAA 32 × 24 thermal sensor), U3 (Infineon BGT60TR13C 60 GHz radar), LS1 (Magnetic sounder 12 × 12 SMD under the tone holes), D1–D16 (RGB LED with driver).
8. Power: the draw at idle and at full load from a 5 V bench supply, against our estimate.
9. Heat: the ESP32-S3 temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	5 and 20: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 7 pass, 5 fixed by the review, 4 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• Wall heat camera: a cold top corner of the outside wall (0.3 m band), grille within 2 m of that wall at 2 m
• Card grade
• Wi-Fi from the bathroom ceiling
• Fast lines on a solid ground plane

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]