ChillOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-CH1-DF-A

We are asking for a turnkey quote: finish the design of our door-frame board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from 120 V AC through an isolating transformer and a current-limited supply, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/chillone-boards.

1. The board

One rigid-flex board inside a walk-in cooler’s door frame: an 8-layer 420 × 82 mm head standing in the header (RV1126B, memory, eMMC, latched microSD, Wi-Fi/BT, LTE-M with eSIM, security chip, tamper switch, heat-camera can at its window, inside call light, air chip on a slotted tongue at the vents); a 36 × 16 camera tab in a U-slot folded 35° out (IMX335 room camera and BGT60TR13C radar); a 6 mm flex to a door tip with a 3D Hall chip over the door magnet; a probe finger with a TMP117 in a glycol vial; and a 24 mm two-layer flex tail into the hinge jamb to an 80 × 160 mm 4-layer panel (e-paper, outside call light, sounder; the soldered IRM-05-5 mains supply, push-in mains terminal, backup cell and charger).

The outline, sections and placement of all 64 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Rockchip RV1126B, FCCSP-409, 0.65 mm pitch; thermal pad to a 50 x 40 x 2 aluminium spreader in the header air	head
U2	LPDDR4X 8 Gbit ×32 (1 GB), 200-ball FBGA	head
U11	eMMC 5.1 8 GB industrial, 153-ball FBGA; shipped empty (the processor tries the eMMC before the card, so an image here would win): our loader on the card is set to read the card first	head
U3	Power: rails for the RV1126B (core, NPU, logic, DDR, 1.8/3.3 V) from the 3.5–5.5 V system rail + inductors	head
Y1	24 MHz MEMS oscillator (SiTime SiT8008 class)	head
Y2	32.768 kHz MEMS oscillator (SiTime SiT1533 class)	head
U8	Microchip ATECC608B security chip, UDFN-8: signs every call and log entry	head
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	head
J1	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; reached through the service cover	head
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	head
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	head
TP1	Factory pads: USB 2.0, debug serial, boot, rails, current sense	head
SW1	Omron D2F-01 tamper switch, pressed by a rib on the screwed service cover (header outside face)	head
U5	AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module (certified), chip antenna at the head top edge	head
Y3	37.4 MHz MEMS oscillator for the AP6256 Wi-Fi/BT module (SiTime SiT8008 class, shock-rated)	head
U41	Quectel BG95-M3 LTE-M / NB-IoT modem, LCC: power-loss and out-of-band alarms by SMS when the site loses power or Wi-Fi	head
U42	MFF2 eSIM, soldered (no SIM socket)	head
U25	MLX90640 3.3 V LDO and I²C pull-ups	head
C1	RV1126B decoupling field (under the chip)	head
U24	Melexis MLX90640ESF-BAA heat-camera chip, 32 × 24, 110 × 75°, TO-39 can on its leads with a 10 mm nylon lead spacer, at the heat window (the coil, warm product, ice)	head
U10	Sensirion SHT45 air temperature and humidity, DFN 1.5 × 1.5, on the slotted tongue at the vents	head
U36	Level shifter for the LED data line (3.3 to 5 V)	head
LH1	M8 lens holder over the camera chip (2 screws), 2.1 mm wide lens about 105° across (est.)	camTab
U20	Sony IMX335LQN-C 5 MP colour camera chip (C1 colour, as CellOne), 88-pin CSP BGA	camTab
U26	Infineon BGT60TR13C 60 GHz radar, antennas in package (1 TX, 3 RX): a person still inside, even in the dark	camTab
U21	Camera LDO 2.9 V (analog)	camTab
U22	Camera LDO 1.8 V (I/O)	camTab
U23	Camera LDO 1.2 V (core)	camTab
Y20	Camera 37.125 MHz MEMS oscillator	camTab
U27	Radar LDOs and 80 MHz MEMS oscillator	camTab
U15	TI TMAG5273A1 3D Hall sensor, SOT-23-6: door shut, ajar angle and the door magnet (no strike-jamb part)	doorTip
U14	TI TMP117 ±0.1 °C temperature sensor, WSON-6, potted in the glycol vial (the buffered product probe)	probeTip
DS1	Waveshare/Good Display 2.13 in e-paper raw panel 250 × 122, glass on foam tape, at the e-paper window (now, min, max)	panel
PD1	E-paper FPC tail hot-bar soldered to pads (no connector)	panel
LS1	Low-profile SMD piezo transducer 9 × 9 under the tone holes	panel
U30	TI BQ24074 1-cell Li-ion charger, 1.5 A, power path, VQFN-16	panel
U31	Cell protection (overcharge, overdischarge, short) + dual FET	panel
U32	Battery gauge, coulomb counting (MAX17260 class)	panel
RS1	Current-sense resistor for the gauge, 2512	panel
U37	Level shifter for the outside LED data line	panel
PS1	Mean Well IRM-05-5 5 V 5 W encapsulated AC-DC module (certified), soldered through the panel	panel
J3	Push-in PCB terminal, 2 poles, 5.0 mm pitch, for the frame’s 120 V heater and light feed wires (Phoenix PTSM/SPT class, est.)	panel
F1	Mains fuse 500 mA slow-blow + MOV 150 V AC	panel
BT1	Li-ion polymer backup cell 1200 mAh 3.7 V (62 × 34 × 5) in a printed clip, leads soldered to pads; NTC thermistor on the pack read by the charger	panel
RT1	NTC thermistor 10 k on the pack (charging held outside 0–45 °C)	panel
U33	E-paper booster (inductor, FET, diodes) and SPI buffer	panel
U34	TI TPS61023 5 V boost for the LEDs during a power cut	panel
TP2	Factory pads: cell, charge current, gauge I²C, mains-side test points (isolated)	panel
D1	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D2	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D3	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D4	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D5	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D6	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D7	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D8	RGB LED with driver, 5050 (WS2812B class), behind the inside opal slot	head
D9	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel
D10	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel
D11	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel
D12	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel
D13	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel
D14	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel
D15	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel
D16	RGB LED with driver, 5050 (WS2812B class), behind the outside opal slot	panel

Each part’s size, side and position is in chillone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RV1126B reference design and our block list. We review it before layout.
2. Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: room camera IMX335 at 2592 × 1944, 2 fps. We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J1, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Room camera: IMX335 streams 2592 × 1944 at 2 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
5. Heat camera: reads a full 32 × 24 frame of a warm target.
6. Radios: U5 (AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module); U41 (Quectel BG95-M3 LTE-M / NB-IoT modem): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: U91 (microSD ESD and filter array), U10 (Sensirion SHT45 air temperature and humidity), U26 (Infineon BGT60TR13C 60 GHz radar), U15 (TI TMAG5273A1 3D Hall sensor), U14 (TI TMP117 ±0.1 °C temperature sensor), DS1 (Waveshare/Good Display 2.13 in e-paper raw panel 250 × 122), D1–D16 (RGB LED with driver).
8. Power: the draw at idle and at full load from 120 V AC through an isolating transformer and a current-limited supply, against our estimate.
9. Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	3 and 10: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 13 pass, 4 fixed by the review, 10 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Power cut
• Card grade
• Wi-Fi to the kitchen’s access point
• LTE-M from inside a building
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Door sensor
• Radar through the frame face
• Cold start in a freezer frame

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]