BedsideOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-B1-TB-A

We are asking for a turnkey quote: finish the design of our table board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from a 5 V bench supply, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/bedsideone-boards.

1. The board

One rigid-flex board in a bedside table: a 4-layer 420 × 376.8 mm top board flat in the hollow top (power lead, charger, two soldered 18650 holders with a thermistor, two NAU7802 load-cell chips with gauge-wire pads, radar rails and flash; notched round the two load-cell blocks), a 60 mm flex bending a 287.4 × 45 mm 2-layer front strip 90° up (VL53L1X walker chip) with a 20 × 26 mm radar tab on a 3 mm flex folded 15° (TI IWRL6432AOP), an 18 mm wide flex about 463 mm long up to a 4-layer 415 × 206 mm head board in the lamp head (OV2640 camera chip under an M7 lens holder, 16 lamp and call-light LEDs, sounder, MEMS mic, tamper switch; ESP32-S3 module, security chip, latched microSD), and a 12 mm wide flex about 523 mm long down to a 240 × 30 mm 2-layer glow strip with 8 LEDs.

The outline, sections and placement of all 52 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Espressif ESP32-S3-WROOM-1-N16R8: ESP32-S3, 16 MB flash, 8 MB PSRAM (camera frames), PCB antenna, FCC/CE certified; castellated, soldered	head
U2	Microchip ATECC608B, UDFN-8: signs every call	head
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	head
J2	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card (ESP32-S3 SD bus; the loader the maker flashes reads our program from it)	head
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	head
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	head
MK1	Infineon IM69D130 MEMS mic, bottom port over a Ø1 hole through the board (the concentrator’s hum and alarm beeps)	head
U7	Level shifter for the LED data lines (3.3 to 5 V), lamp head and floor glow	head
U11	Camera rails: 2.8 V analog, 1.3 V core LDOs and the 24 MHz MEMS oscillator for the camera chip	head
U10	OmniVision OV2640 2 MP camera chip (chip-scale package) under an M7 lens holder with a 66 × 52° lens, looking straight down at the pill box through the Ø10 window	head
GK1	Silicone sound gasket Ø5 × 8 from the board hole to the mic port in the cover	head
LS1	Magnetic sounder 12 × 12 SMD over the tone holes (the soft chime)	head
Q1	Sounder driver FET	head
SW1	Omron D2F-01, plunger down, pressed by the lamp cover’s 1.5 mm boss when the cover is screwed on	head
TP1	Factory pads: USB (ESP32-S3 native), serial, boot, enable, rails, current sense	head
J1	Molex Micro-Fit 3.0 single-row vertical header, 2 circuits, latched: 5 V and ground from the listed USB adapter’s lead	top
U4	5 V input: polyfuse, TVS, reverse block; TI BQ24074 1S charger with power path (1 A, NTC input); TI TPS63020 3.3 V buck-boost	top
BT1	Keystone 1042 SMT holder for one 18650 cell (Samsung INR18650-35E), back cell	top
BT2	Keystone 1042 SMT holder for one 18650 cell (Samsung INR18650-35E), front cell	top
RT1	NTC thermistor 10 k, 0603, between the two cell holders, read by the BQ24074 so charging holds outside 0–45 °C	top
U5	Nuvoton NAU7802 24-bit load-cell chip for the pill-box plate’s 1 kg bar, with its four gauge-wire pads	top
U6	Nuvoton NAU7802 24-bit load-cell chip for the when-required plate’s 1 kg bar, with its four gauge-wire pads	top
PD1	Four solder pads for the load cell’s gauge wires (red, black, white, green), strain-relief slot beside them	top
PD2	Four solder pads for the load cell’s gauge wires, strain-relief slot beside them	top
U8	Radar rails (TI LP87745 class PMIC), 40 MHz crystal and 2 MB QSPI flash for the radar’s own program	top
TP2	Factory pads: 5 V in, battery, 3.3 V, charger status	top
U12	ST VL53L1X time-of-flight distance chip at the walker window (27° cone)	front
U3	TI IWRL6432AOP 60 GHz radar, antennas in package (2 TX, 3 RX), low-power tracking: the parent sitting up, at the bed edge, walking out and back, walking speed	tab
D1	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D2	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D3	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D4	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D5	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D6	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D7	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D8	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D9	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D10	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D11	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D12	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D13	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D14	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D15	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D16	RGB LED with driver, 5050 (WS2812B class), over the thinned opal	head
D17	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow
D18	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow
D19	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow
D20	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow
D21	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow
D22	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow
D23	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow
D24	RGB LED with driver, 5050 (WS2812B class), amber at night, behind the kick board’s opal slot	glow

Each part’s size, side and position is in bedsideone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Espressif’s ESP32-S3 hardware design guide and our block list. We review it before layout.
2. Layout in our outline and placement, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Firmware: flash our small ESP32-S3 loader (we send it). At each start it reads our program from the microSD card, so a new card is a software update.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J2, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts our loader and a test program from the microSD card.
4. Pill camera: OV2640 streams 1600 × 1200 at 2 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
5. Pill camera: OV2640 streams 1600 × 1200 at 2 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
6. Radios: U1 (Espressif ESP32-S3-WROOM-1-N16R8): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: U91 (microSD ESD and filter array), MK1 (Infineon IM69D130 MEMS mic), LS1 (Magnetic sounder 12 × 12 SMD over the tone holes), U8 (Radar rails), U3 (TI IWRL6432AOP 60 GHz radar), D1–D24 (RGB LED with driver).
8. Power: the draw at idle and at full load from a 5 V bench supply, against our estimate.
9. Heat: the ESP32-S3 temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	5 and 20: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 16 pass, 2 fixed by the review, 7 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• Power cut
• Card grade
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Every bedside call in the radar’s view
• Tamper switch against the lamp cover
• The two long flexes

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]