BayOne board: request for quote
From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-B1-SH-A
We are asking for a turnkey quote: finish the design of our signal-head board set, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from the head’s own mains feed through the power board, or a 5 V 4 A bench supply on lead L1, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.
All files are in the design pack (zip). The board, part by part: iemilabs.com/build/bayone-boards.
1. The board
Five boards and four tabs inside a 3-aspect 200 mm traffic-signal head. One rigid-flex piece: an 8-layer 110 × 90 mm main board flat on the head floor (RK3576J with a heat block to an aluminium spreader, 4 GB LPDDR4X, 32 GB eMMC, latched microSD, RK806S power, MEMS clocks, security and ID chips, eFuse, MAX98357A horn amp and speaker wire pads, latched 6-pin lead header); a 4-layer 122 × 180 mm back strip on an 88 mm flex (bay camera and heat camera tabs, their supplies); a 4-layer 115 × 110 mm radar strip on a flex (radar tab and supplies); a 4-layer 240 × 795 mm front board on a 122 mm flex (72 aspect LEDs and three drivers, the approach camera tab, the BG95-M3 LTE-M module with a soldered eSIM and chip antenna, the AP6275S Wi-Fi/BT module, a Hall tamper switch); four 16 × 16 mm tabs on 40 mm flex hinges (two IMX415 with M12 lens holders, an MLX90640 heat chip, a TI IWRL6432AOP radar chip). A separate 2-layer 140 × 140 mm power board: spring-clamp mains terminal, fuse, varistor, Mean Well IRM-20-5, a soldered 18650 holder with a thermistor and charger, an Omron G5V-1 relay with its spring-clamp terminal, latched 6-pin header. Lead L1 made to length.
The outline, sections and placement of all 118 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.
2. Parts
| Ref | Part | Where |
|---|---|---|
| U1 | Rockchip RK3576J (industrial), 8 cores, 6 TOPS NPU, 16 MP ISP; heat block down to the aluminium spreader on the head floor | main |
| HS1 | Aluminium block 24 × 24 × 7.7 with 1 mm gap pads, from the RK3576J to a 3 mm aluminium spreader on the head floor, bolted through to the 12 mm steel base plate on the push wall | main |
| U2 | LPDDR4X 32 Gbit ×32 (4 GB), 200-ball FBGA | main |
| U11 | eMMC 5.1 32 GB industrial, 153-ball FBGA (shipped empty, so the card always starts first; our loader on the card reads the card first; keeps the load log and the call log) | main |
| C1 | RK3576J decoupling field (behind the chip) | main |
| U3 | Rockchip RK806S-5 power chip and inductors: RK3576J core, NPU, GPU, logic, DDR and 1.8/3.3 V from the 5 V rail | main |
| Y1 | 24 MHz MEMS oscillator (SiTime SiT8008 class) | main |
| Y2 | 32.768 kHz MEMS oscillator (SiTime SiT1533 class) | main |
| U8 | Microchip ATECC608B security chip, UDFN-8: signs every bay call, load record and heat alarm into the append-only log | main |
| U9 | ID EEPROM 2 kbit (product, board version, serial, calibration) | main |
| J1 | microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; reached by opening the door | main |
| U90 | microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled | main |
| U91 | microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line | main |
| U31 | Analog Devices MAX98357A I2S class-D amp, 3.2 W (the horn and the call tones) | main |
| PD1 | Solder pads for the 28 mm horn speaker’s and the piezo’s own wires (both stay over their floor holes), strain-relief slot beside them | main |
| J2 | Molex Micro-Fit 3.0 43045-0612 6-pin vertical header, positive latch (5 V ×2, GND ×2, cell sense, relay drive) for lead L1 | main |
| U42 | TI TPS25947 class eFuse (3.5 A, reverse block) + TVS on the 5 V from the power board | main |
| TP1 | Factory pads: USB 2.0, debug serial, boot, rails, current sense | main |
| U21 | Bay camera LDOs 2.9 / 1.8 / 1.1 V and its 37.125 MHz MEMS oscillator | back |
| U23 | 3.3 V LDO for the MLX90640 and its I²C level shifter | back |
| U25 | ESD and TVS array on the camera and heat lines (dust charges the head) | back |
| U24 | IWRL6432 1.8 / 1.2 V supply and its 40 MHz MEMS oscillator | radar |
| U27 | ESD and TVS array on the radar lines | radar |
| DG1 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG2 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG3 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG4 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG5 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG6 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG7 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG8 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG9 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG10 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG11 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG12 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG13 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG14 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG15 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG16 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG17 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG18 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG19 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG20 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG21 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG22 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG23 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DG24 | green high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm green lens: the bay call | front |
| DA1 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA2 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA3 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA4 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA5 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA6 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA7 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA8 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA9 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA10 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA11 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA12 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA13 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA14 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA15 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA16 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA17 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA18 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA19 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA20 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA21 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA22 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA23 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DA24 | amber high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm amber lens: the bay call | front |
| DR1 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR2 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR3 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR4 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR5 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR6 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR7 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR8 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR9 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR10 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR11 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR12 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR13 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR14 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR15 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR16 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR17 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR18 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR19 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR20 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR21 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR22 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR23 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| DR24 | red high-brightness LED, PLCC-4 3.5 × 2.8 (Osram Power TOPLED class), behind the 200 mm red lens: the bay call | front |
| U70 | Constant-current LED driver for the green aspect (two strings of 12, PWM dimmed for night, open-LED detect so a dead aspect is reported) | front |
| U71 | Constant-current LED driver for the amber aspect (two strings of 12, PWM dimmed for night, open-LED detect so a dead aspect is reported) | front |
| U72 | Constant-current LED driver for the red aspect (two strings of 12, PWM dimmed for night, open-LED detect so a dead aspect is reported) | front |
| U5 | AMPAK AP6275S Wi-Fi 6 + Bluetooth 5 module (certified, RK3576 SDK default): BLE pairing for the loader driver’s phone; antenna at its left edge behind the door, outside the red aspect | front |
| U6 | Quectel BG95-M3 LTE-M / NB-IoT module, LGA (certified): load records, calls and heat alarms to the cloud; no inbound ports | front |
| U6S | Soldered eSIM (MFF2), no card slot to knock loose | front |
| U7 | TI DRV5032FB Hall switch facing the door: a Ø6 × 3 magnet on a printed boss on the door holds it; opening the door is logged and signed | front |
| U26 | Approach camera LDOs 2.9 / 1.8 / 1.1 V and its 37.125 MHz MEMS oscillator | front |
| J10 | WAGO 2604 class 3-pole spring-clamp PCB terminal for the head’s own feed (L, N, PE), 7.5 mm pitch, behind a printed shield | power |
| F10 | 2 A slow fuse, 275 V varistor and the class II creepage slot | power |
| PS1 | Mean Well IRM-20-5 PCB-mount 5 V 4 A 20 W supply (class II, listed) | power |
| BT1 | Keystone 1042 class 18650 holder, soldered, with one Samsung INR18650-35E cell: keeps the heat watch and LTE-M alarm path going in a power cut | power |
| RT1 | 10 k NTC thermistor against the cell, read by the charger | power |
| U50 | TI BQ25895 class charger with power-path: charges the cell at 1 A only between 0 and 45 °C | power |
| K1 | Omron G5V-1 relay: the supervisory contact to the site’s listed fire-panel monitor module (never a fire alarm itself) | power |
| J11 | WAGO 2604 class 2-pole spring-clamp PCB terminal for the monitor module’s pair | power |
| J12 | Molex Micro-Fit 3.0 43045-0612 6-pin vertical header, positive latch, for lead L1 | power |
| U200 | Sony IMX415-AAQR-C 8 MP colour camera chip (C1, 3840 × 2160), 22° down and 58° into the bay: every tipped load, banned items, the pile height | tab |
| LH1 | M12 lens holder with a 102 × 69.6° lens, its front 0.3 mm inside the wall at the closest corner, the lens barrel 7.7 mm on through the window to just inside the face | tab |
| U240 | Melexis MLX90640ESF-BAB 32 × 24 heat chip, 110° × 75° lens in its TO39 can, 12° down at the pile | tab |
| U250 | TI IWRL6432AOP 60 GHz radar chip with its antennas on the package, 40° down behind the PC radome: people near the truck and the loader | tab |
| U260 | Sony IMX415-AAQR-C 8 MP colour camera chip (C1), 15° down to the yard: the truck reversing in, its fleet number, people in the lane | tab |
| LH4 | M12 lens holder with a 102 × 69.6° lens, its front 0.3 mm inside the wall at the closest corner, the lens barrel 8.5 mm on through the window to just inside the face | tab |
Each part’s size, side and position is in bayone-board-parts.csv in the pack. Ask before you substitute a part.
3. Scope of work
- Schematic from Rockchip’s RK3576 reference design and our block list. We review it before layout.
- Layout in our outline and placement: the RK3576 memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
- Fabrication of the rigid-flex board.
- Sourcing of all parts.
- Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
- Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RK3576 SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: bay camera IMX415 at 3840 × 2160, 10 fps; approach camera IMX415 at 3840 × 2160, 10 fps. We add our own software on top.
- Test of every board to the acceptance list in §5, with a test report per serial number.
- Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.
4. “Ready to run” on delivery
This is the most important part of the job:
- Every board arrives assembled, programmed and tested.
- We put our microSD card in (J1, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
- The ID EEPROM is written with the serial number and board revision.
- The security chip is provisioned per the steps we will send.
5. Acceptance tests (each board, with report)
- Current-limited first power-on: no short, idle current within the agreed limit.
- Rails: every power rail within ±3 %.
- Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
- Bay camera: IMX415 streams 3840 × 2160 at 10 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
- Approach camera: IMX415 streams 3840 × 2160 at 10 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
- Heat camera: reads a full 32 × 24 frame of a warm target.
- Radios: U6 (Quectel BG95-M3 LTE-M / NB-IoT module): each joins or answers a test station.
- Sensors and outputs, each read or driven in turn: U91 (microSD ESD and filter array), U27 (ESD and TVS array on the radar lines), U7 (TI DRV5032FB Hall switch facing the door), K1 (Omron G5V-1 relay), U250 (TI IWRL6432AOP 60 GHz radar chip with its antennas on the package).
- Power: the draw at idle and at full load from the head’s own mains feed through the power board, or a 5 V 4 A bench supply on lead L1, against our estimate.
- Heat: the RK3576J temperature after 1 hour at full load in a 35 °C room, against our estimate.
6. Quantities and timing
| Item | Quantity |
|---|---|
| Rev A boards | 5 and 20: please quote both |
| Budget prices | for 100 and 1,000 boards |
| Quote wanted | within two weeks of this request |
| Boards wanted | please give your lead times for design, fabrication and assembly |
7. Our design review
Before we order, every board-level number is checked against its target: 17 pass, 4 fixed by the review, 12 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:
- Heat camera: a 1 m hot patch on the pile face at 14.68 m
- AI engine time per frame
- Power cut
- Card grade
- LTE-M from the top of the signal head
- Fast lines on a solid ground plane
- Board inside the product CAD, every part checked in 3D
- Sensor tabs on their brackets
- Aspects behind the 200 mm lenses
- Mains kept on its own board
- Flexes and the lead
- Door tamper sensor
8. The design pack
Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.
Questions: [email protected]