StudyOne board: request for quote

From: IEMI Labs, [email protected] · Date: 4 November 2026 · Reference: IEMI-S1-LB-A

We are asking for a turnkey quote: finish the design of our lamp board, make it, assemble it, test it, and deliver boards that are ready to run. When a board arrives, we power it from a 5 V 3 A bench supply on the USB-C inlet, put in our microSD card, and it starts our software. We do no setup, soldering or configuration.

All files are in the design pack (zip). The board, part by part: iemilabs.com/build/studyone-boards.

1. The board

One rigid-flex board in a child’s desk lamp: an 8-layer 358 × 50 mm head board flat 12 mm above the opal head cover (RV1126B with a heat block to the steel arm, memory, eMMC, latched microSD, Wi-Fi/BT, security and ID chips, IMX415 camera chip under an M12 lens holder, 16 white reading LEDs and their constant-current driver, 8 call-light LEDs, VEML7700 under a light pipe, MEMS mic, tamper switch); a 12 × 12 mm eye tab in a U-slot at the front end on a 2 mm flex, folded 45° (VL53L1X); an 18 mm two-layer flex tail about 0.5 m down the column; and a 4-layer 80 × 60 mm base board (USB-C power-only inlet, eFuse, MAX98357A speaker amp and speaker wire pads).

The outline, sections and placement of all 61 parts are fixed (KiCad 10 file, design rule check: 0 violations), each checked against our mechanical CAD. Please keep the outline and part positions, and tell us if anything must move.

2. Parts

Ref	Part	Where
U1	Rockchip RV1126B, FCCSP-409, 0.65 mm pitch; heat block to the arm’s top wall	head
HS1	Aluminium block 20 × 20 × 7.7 with 1 mm gap pads on both faces, from the RV1126B to the steel head arm’s top wall (the arm is the heat sink)	head
U2	LPDDR4X 8 Gbit ×32 (1 GB), 200-ball FBGA	head
U11	eMMC 5.1 8 GB industrial, 153-ball FBGA; shipped empty (the processor tries the eMMC before the card, so an image here would win): our loader on the card is set to read the card first (shipped empty, so the card always starts first; our loader on the card reads the card first)	head
U3	Power: rails for the RV1126B (core, NPU, logic, DDR, 1.8/3.3 V) from the 5 V rail + inductors	head
Y1	24 MHz MEMS oscillator (SiTime SiT8008 class)	head
Y2	32.768 kHz MEMS oscillator (SiTime SiT1533 class)	head
U8	Microchip ATECC608B security chip, UDFN-8: signs every call and the evening summary	head
U9	ID EEPROM 2 kbit (product, board version, serial, calibration)	head
U5	AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module (certified), chip antenna at the board’s left edge over the opal cover	head
Y3	37.4 MHz MEMS oscillator for the AP6256 Wi-Fi/BT module (SiTime SiT8008 class, shock-rated)	head
U36	Level shifter for the call-light data line (3.3 to 5 V)	head
U13	Constant-current LED driver for the 16 white LEDs, analogue dimming (no flicker), thermal fold-back (TI LM3414 class, est.)	head
MK1	Infineon IM69D130 MEMS mic, bottom port over a Ø1 hole through the board (reading aloud, spelling)	head
U21	Camera LDO 2.9 V (analog)	head
U22	Camera LDO 1.8 V (I/O)	head
U23	Camera LDO 1.1 V (core)	head
Y20	Camera 37.125 MHz MEMS oscillator	head
TP1	Factory pads: USB 2.0, debug serial, boot, rails, current sense	head
C1	RV1126B decoupling field (under the chip)	head
LH1	M12 low-profile lens holder (2 screws) with a 90° × 59° lens over the camera chip, its front 0.5 mm above the cover	head
U20	Sony IMX415-AAQR-C 8 MP colour camera chip (C1, 1/2.8 in, 3840 × 2160), looking straight down at the page	head
U24	Vishay VEML7700 ambient light chip, under a Ø3 light pipe to the page-light window	head
LP1	Clear PC light pipe Ø3 from the page-light chip to the window	head
GK1	Silicone sound gasket Ø5 × 12 from the board hole to the mic port in the cover	head
SW1	Omron D2F-01, plunger down, pressed by a 5.5 mm boss on the head cover when it is screwed on	head
J1	microSD socket with a hinged, latched lid (Amphenol 101-00660 class), fitted on every board: our software starts from the card; reached by taking off the head cover	head
U90	microSD card power switch (TPS22917-class load switch, 3.3 V, driven by the card power-enable pin) with a 10 kΩ discharge resistor: a stuck card can be power-cycled	head
U91	microSD ESD and filter array, 6 lines (TPD6F003-class), with 22 Ω series resistors on CLK, CMD and D0–D3 and the card-detect line	head
U12	ST VL53L1X time-of-flight distance chip (27° cone), on the tab folded 45° to the child’s head	tab
U14	VL53L1X 2.8 V LDO and I²C pull-ups	tab
J2	GCT USB4125 class 6-pin power-only USB-C receptacle (5 V, CC pull-downs), mouth at the base’s back inlet; the only socket	base
U30	TI TPS25947 class eFuse (3.5 A limit, reverse block) + TVS on the 5 V inlet	base
U31	Analog Devices MAX98357A I2S class-D amp, 3.2 W	base
PD1	Two solder pads for the 28 mm speaker’s wires, strain-relief slot beside them	base
U32	Bulk capacitors and the ferrites for the 5 V up the tail (3 A, est.)	base
TP2	Factory pads: 5 V in, eFuse status, amp I2S	base
D1	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D2	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D3	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D4	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D5	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D6	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D7	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D8	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D9	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D10	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D11	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D12	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D13	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D14	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D15	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D16	White LED 2835, 4000 K, CRI 95 (Samsung LM281B+ class), over the thinned opal	head
D17	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head
D18	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head
D19	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head
D20	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head
D21	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head
D22	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head
D23	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head
D24	RGB LED with driver, 5050 (WS2812B class), over the thinned opal: green tick, amber look again, blue break	head

Each part’s size, side and position is in studyone-board-parts.csv in the pack. Ask before you substitute a part.

3. Scope of work

1. Schematic from Rockchip’s RV1126B reference design and our block list. We review it before layout.
2. Layout in our outline and placement: the RV1126B memory and power routing, impedance-controlled MIPI and USB, and RF for every antenna keep-out. Lay the fast lines on a solid ground plane (inner layer 1, supply on inner layer 2; on a 2-layer section the whole bottom is ground under the module), with one via beside each ground and supply pad and no vias in pads unless you quote filled and capped vias (IPC-4761 type VII); no copper or vias in the antenna keep-out on any layer, none under the card socket; route the impedance lines first (camera MIPI pairs 100 Ω differential, USB 90 Ω, antenna 50 Ω) and add an impedance test coupon. Include the stack-up proposal and DFM, and a rigid-flex drawing (bend lines, stiffeners, coverlay).
3. Fabrication of the rigid-flex board.
4. Sourcing of all parts.
5. Assembly, both sides, with X-ray inspection of the ball-grid parts. Conformal coating (IPC-CC-830), with the sensors, sockets, connectors and antennas masked.
6. Board support package: U-Boot and a Linux device tree for this layout from Rockchip’s RV1126B SDK. A Rockchip SDK image must start from the microSD card. Camera drivers: page camera IMX415 at 3840 × 2160, 5 fps; page camera IMX415 at 3840 × 2160, 5 fps. We add our own software on top.
7. Test of every board to the acceptance list in §5, with a test report per serial number.
8. Deliverables: KiCad (or Altium) source, Gerbers, drill, pick-and-place, BOM, stack-up, test procedure and reports, and the BSP source.

4. “Ready to run” on delivery

This is the most important part of the job:

• Every board arrives assembled, programmed and tested.
• We put our microSD card in (J1, a hinged, latched socket) and power it, and it starts. No soldering, no jumpers, no settings, no flashing.
• The ID EEPROM is written with the serial number and board revision.
• The security chip is provisioned per the steps we will send.

5. Acceptance tests (each board, with report)

1. Current-limited first power-on: no short, idle current within the agreed limit.
2. Rails: every power rail within ±3 %.
3. Boot: starts the Rockchip SDK image from the microSD card to a shell over the debug UART; the eMMC is detected and can be written.
4. Page camera: IMX415 streams 3840 × 2160 at 5 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
5. Page camera: IMX415 streams 3840 × 2160 at 5 fps with no lost frames over 10 minutes, and a frame of a test chart is saved.
6. Radios: U5 (AMPAK AP6256 Wi-Fi 5 + Bluetooth 5 module): each joins or answers a test station.
7. Sensors and outputs, each read or driven in turn: MK1 (Infineon IM69D130 MEMS mic), U91 (microSD ESD and filter array), D1–D16 (White LED 2835), D17–D24 (RGB LED with driver).
8. Power: the draw at idle and at full load from a 5 V 3 A bench supply on the USB-C inlet, against our estimate.
9. Heat: the RV1126B temperature after 1 hour at full load in a 35 °C room, against our estimate.

6. Quantities and timing

Item	Quantity
Rev A boards	5 and 20: please quote both
Budget prices	for 100 and 1,000 boards
Quote wanted	within two weeks of this request
Boards wanted	please give your lead times for design, fabrication and assembly

7. Our design review

Before we order, every board-level number is checked against its target: 15 pass, 5 fixed by the review, 9 to prove on rev A, 0 fail. The full review is on the board page and in the pack. Rev A must let us measure:

• AI engine time per frame
• Card grade
• Wi-Fi from inside a steel lamp head
• Fast lines on a solid ground plane
• Board inside the product CAD, every part checked in 3D
• Reading light for a child’s eyes
• Head arm surface a child can touch
• Tamper switch against the head cover
• Tail down the column

8. The design pack

Download the design pack (zip): this request, the KiCad 10 board, a 3D model (STEP), side A and side B drawings (PDF), the parts list, placement, the board outline and drawing layers as Gerbers, and the design review.

Questions: [email protected]